Interfacing computer system modules

ABSTRACT

An information processing module forms a blade for a high density computer system. A processor is operable to perform information processing and an information signal interface is connected between the processor(s) and a module information signal connection. A service controller is operable to perform system management functions and is connected to a module management connection. Redundant sets of information and management signal connections can be provided. The information signal interface and the service controller provide a buffer between the processor of the information processing module and the remainder of the modular computer system enabling flexibility in the choice of processor and internal structure for the information processing module.

BACKGROUND OF THE INVENTION

[0001] The present invention relates to computer systems, in particularto multiprocessor systems, for example multiprocessor server systems.

[0002] One application for the present invention relates to high densitycomputer systems, for example, computer server systems fortelecommunications applications. In telecommunications applications, itis important to provide high reliability and high capacity of operation.Various approaches have been taken to providing such high-performance,high reliability systems. Typically such systems are designed aroundproviding redundant resources so that if one component of the systemdevelops a fault, the system remains operational using the redundantresources. Fault tolerance can also be achieved, for example, withmultiprocessor systems that provide redundancy through dynamic, e.g.,software-controlled, task distribution. High density systems aretypically rack mountable, with one or more processor systems occupying ashelf in the rack. The trend in recent times is to make the computerswith smaller form factors. This means that more computers can be locatedin a rack. This has the advantage of increasing the processing densitywithin the racks, and also the advantage of reducing the distancebetween the computer systems.

[0003] The present invention relates to the provision of an informationprocessing module for a modular computer system that can interface withother modules in the computer system while providing flexibility withregard to the design of the hardware of the information processingmodule.

SUMMARY OF THE INVENTION

[0004] An aspect of the invention provides an information processingmodule for a modular computer system. One or more processors can beoperable to perform information processing. One or more moduleinformation connections can be operable to enable the communication ofinformation signals. One or more module information signal interfacescan be connected between the processor(s) and the module informationconnection(s). One or more module management connections can be operableto enable communication of management signals. One or more servicecontrollers can be operable to perform system management functions. Theservice controller(s) can be connected to the module managementconnection(s).

[0005] By providing an information signal interface between a moduleprocessor and a module information connection and providing a moduleservice controller operating via a module management connection,flexibility on the choice of a processor and an internal structure forthe information processing module is achieved. The information signalinterface and the module service controller serve to provide a bufferbetween the information processing module and the remainder of themodular computer system. The information signal interface isolates theprocessor from the external information protocol used. The servicecontroller enables the processor to be relieved of many of the systemmanagement functions, these being performed via the service controllerand the dedicated management connection.

[0006] Providing the information signal interfaces with an informationprotocol interface (e.g., an Ethernet interface or an Infinibandinterface) can enable the processor(s) in the module to communicateusing an appropriate information signal protocol with other modules ofthe modular computer system. Providing the information signal interfaceswith an appropriate module information physical layer interface (e.g. aserializer/deserializer) can enable the physical interconnection of theinformation processing module and can support the selected informationsignal protocol.

[0007] A plurality of module information connections (e.g., two moduleinformation connections) can provide for redundancy of operation in caseone of the connections or components connected thereto fail.

[0008] The module management connection can be in the form of a serialconnection. A plurality of module management connections (e.g., twomodule management connections) can be provided for redundancy ofoperation in case one of the connections or components connected theretofail. The module service controller can be connected to each modulemanagement connection.

[0009] The information processing module can include an internal storagedevice. An enclosure for the information processing module, wherein theinformation and management connection are accessible externally to theenclosure, can protect the information processing module and make itmore suitable as a customer replaceable unit, or CRU, for example as acustomer replaceable server blade for a high density computer system.

[0010] Another aspect of the invention provides a server blade for amodular computer system. The server blade can include a processoroperable to perform information processing. A blade informationconnection can provide for communicating information signals. A bladeinformation signal interface can be connected between the processor andthe blade information connection. A blade management connection canprovide for communicating information signals. A service controllerconnected to the blade management connection can be operable to performsystem management functions.

[0011] A further aspect of the invention provides a computer systemconfigured to receive one or more information processing modules asreferenced above, the modular computer system comprising a carrier. Thecarrier can include one or more module receiving locations configured toreceive such an information processing module. The module receivinglocation(s) can include one or more carrier information connections,each operable to interconnect with a corresponding module informationconnection of a received information processing module, and one or morecarrier management connections, each operable to interconnect with acorresponding module management connection of a received informationprocessing module. One or more switches can be connected to the carrierinformation connection(s) of the module receiving location(s) and beoperable to connect the information processing module to an externalinformation network. One or more carrier service processors can beconnectable to the carrier management connection(s) of the modulereceiving location(s) and be operable to exchange system managementsignals with the information processing module service controller. Themodule receiving location(s) can be configured removably to receive theinformation processing module(s).

[0012] Each of a plurality of switches (e.g., two) can be connectable toa respective carrier information connection at each module receivinglocation to provide redundancy of operation. The switches can each beprovided in a separate, removable, module. The module can also include arespective service processor to form a combined switch and serviceprocessor module. Where there are two service processors, a one serviceprocessor can be operable as a master service processor and the otherservice processor can be operable as a backup service processor.

[0013] One or more power supplies can also be connectable to eachinformation processing module received in a carrier receiving locationvia respective power connections.

[0014] In one example, the carrier is a rack mountable shelf forming ablade server system where each received information processing moduleforms a server blade.

[0015] Another aspect of the invention provides a method of providing aprocessor technology independent information server blade for a modularserver system. The method includes one or more blade processorscommunicating information signals with other modules of the serversystem via at least one blade information signal interface between theprocessor(s) and one or more blade information connections forcommunicating information signals. It further includes one or moreservice controllers in the blade performing system management functionswithin the blade and communicating management signals to other modulesof the server system via one or more module management connections.

[0016] Further aspects and advantages of the invention will becomeapparent from the following description of particular embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Embodiments of the present invention will be describedhereinafter, by way of example only, with reference to the accompanyingdrawings in which like reference signs relate to like elements and inwhich:

[0018]FIG. 1 is a schematic representation of an architecture of amultiprocessor system for supporting a web site;

[0019]FIG. 2 is a schematic representation of a racking systemincorporating an example of a carrier in the form of a rack-mountableshelf according to a first example;

[0020]FIG. 3 is a front view of an example of a carrier in the form of ashelf of FIG. 2;

[0021]FIG. 4 is a rear view of an example of the shelf of FIG. 2;

[0022]FIGS. 5A, 5B and 5C are schematic perspective views and aschematic exploded view respectively of an example of an informationprocessing cartridge for mounting in the shelf of FIG. 2;

[0023]FIG. 5D is a schematic perspective view of an example of aninformation processing cartridge for mounting in the shelf of FIG. 2;

[0024]FIG. 6 is a schematic perspective view of an example of a combinedswitch and service processor module for mounting in the shelf of FIG. 2;

[0025]FIG. 7 is a schematic perspective view of an example of a powersupply module for mounting in the shelf of FIG. 2;

[0026]FIGS. 8A, 8B and 8C are a schematic plan view and schematicperspective views, respectively, of an example of the chassis andmidplane of the shelf of FIG. 2;

[0027]FIG. 8D is a schematic perspective view of a part of a base memberof the shelf of FIG. 2;

[0028]FIGS. 9A, 9B and 9C are schematic front, top and rear views,respectively, of an example of a midplane of the shelf of FIG. 2;

[0029]FIG. 10 is a schematic cross section view through the shelf ofFIG. 2;

[0030]FIG. 11 is a functional block diagram of an example of aninformation processing subsystem for the information processingcartridge of FIG. 5;

[0031]FIG. 12 is a functional block diagram of an example of aninformation processing subsystem for the combined switch and serviceprocessor module of FIG. 6;

[0032]FIG. 13 is a functional block diagram of an example of a subsystemfor the power supply unit of FIG. 7;

[0033]FIG. 14 is a functional block diagram showing the connectivitybetween the components of the shelf of FIG. 2;

[0034]FIG. 15 is a functional block diagram showing the externalconnectivity of the shelf of FIG. 2;

[0035]FIG. 16 is a schematic representation of a shelf showing theexternal connections from the shelf of FIG. 2;

[0036]FIG. 17 is a schematic representation of a rack mounted systemcomprising a plurality of such shelves;

[0037]FIG. 18 is a functional block diagram of a further example of aninformation processing subsystem for the information processingcartridge of FIG. 5; and

[0038]FIGS. 19A and 19B illustrated different examples of informationprotocol interfaces for an information processing cartridge.

[0039] While the invention is susceptible to various modifications andalternative forms, specific embodiments are shown by way of example inthe drawings and are herein described in detail. It should beunderstood, however, that drawings and detailed description thereto arenot intended to limit the invention to the particular form disclosed,but on the contrary, the invention is to cover all modifications,equivalents and alternatives falling within the spirit and scope of thepresent invention as defined by the appended claims.

DESCRIPTION OF PARTICULAR EMBODIMENTS

[0040] Embodiments and examples are described hereafter by way ofexample only in the following with reference to the accompanyingdrawings.

[0041] Shown in FIG. 1 is an example of an application of a highcapacity multiserver system 1 for implementing a network-connected website such as, for example, an airline reservation system on the WorldWide Web.

[0042] As shown in FIG. 1, an external network 3 (e.g., the Internet)for communicating with a user 5 can be connected to gateways 7 which canbe connected to an entry edge server group 9 implemented by a web farmas shown in FIG. 1. The entry edge server group 9 forms an interface tothe external network 3. The entry edge server group 9 can then beconnected by switches 11 and a firewall 13 to a web edge server group 15that can also be implemented as a web farm as shown in FIG. 1. The webedge server group 15 can serve to cache web pages that are readilyaccessible to users 5 accessing the system 1 from the external network3, for example for checking flight times, etc. The web edge server groupcan comprise a number of blade server (BS) shelves and a number ofnetwork addressable storage (NAS) shelves for storing critical data. Theweb edge server group 15 can be further connected by a further firewall17 to a plurality of application servers 19, which can be responsiblefor, for example, processing flight reservations. The applicationservers 19 can then be connected via a further firewall 21 to computersystems 23, 25, for example, e-commerce services including financialservices for receiving and processing payment for airline reservations.

[0043] As will be appreciated, the server system described above withreference to FIG. 1 is only an example of a possible application for amultiprocessor server system. Multiprocessor server systems have manydifferent applications and the present system is not limited to beingapplicable for use in only one or a limited number of such applications,rather multiprocessor server systems as described herein are operablefor use in many different applications. A non-exhaustive list of suchalternative applications includes: e-commerce web server systems;telecommunications network server systems; LAN application and fileserver systems and remote vehicle control systems.

[0044] With reference to FIG. 2, there is shown a schematic perspectiverepresentation of a rack system 31 as viewed from the front includingleft and right front uprights 32 and 33 and left and right rear uprights34 and 35. The uprights can be formed with apertures for receiving shelffixings (e.g., screws, bolts, clips, etc., for mounting brackets,slides, rails, etc.).

[0045] Also shown in FIG. 2 is an example of a blade server shelf 41mounted in the rack system 31. The shelf 41 forms a carrier configuredto carry a plurality of information processing cartridges 43 locatedside by side along the shelf.

[0046] The term “shelf” is used herein in a conventional way to describea structure that is mountable in rack system 31 and is configured tocarry one or more components to form at least a part of a rack-mountablesystem. In the present example, the shelf 41 is three-dimensional,having a height (H), width (W) and depth (D). In the present example,one dimension (hereinafter described as the height, H) is smaller thanthe other dimensions (hereinafter described as the depth, D, and thewidth, W) to facilitate mounting of the shelf within the rack system 31.It will be appreciated that although the width and depth are typicallyconstrained by the dimensions of the racking system for which the shelfis designed, there is more freedom as regard the height, subject totaking account of any appropriate standards and packagingconsiderations.

[0047] Each of the information processing cartridges contains at leastone processor. Each information processing cartridge in the presentexample is operable as a server. In the described examples, theinformation processing cartridges are configured as robust enclosedmodules.

[0048] In the example to be described in more detail presently, theinformation processing cartridges, when aligned in the carrier shelf,look like rectangular slabs, or blades. Accordingly, an informationprocessing cartridge can be described as a blade. The informationprocessing cartridges 43 comprise information processing modulesenclosed in an enclosure, or housing, so that the information processingmodules have the form of cartridges. Also, as the information processingcartridges are to operate as computer servers in the example describedin more detail presently, an information processing cartridge 43 canalso be described as a server blade. Accordingly, in the context of thisexample, the terms module, cartridge and blade are used interchangeably.

[0049] The illustrated example of a shelf 41 is configured to carrysixteen information processing cartridges 43, each of which is removablymountable in a respective opening 45 in the front of the shelf, wherebythe information processing cartridges can be inserted into and removedfrom the front of the shelf 41 without removing the shelf 41 from therack system 31.

[0050] In the present example, the shelf 41 comprises athree-dimensional, generally rectangular, enclosure, or housing, 47 thatis suitable for mounting in generic racking systems including both4-post and 2-post systems. It can be mounted on fixed rigid rackmounting ears and/or a simple slide/support system. The present exampleis designed for standard 19″-wide racking (1″=25.4 mm) as defined, forexample, in the well-known IEC297 and EIA 310 specification standardswith height corresponding to the so-called 3U (3 standard unit) height.For mounting such a 3U unit in such a 19″-wide racking system, with adepth of, say 25″ or 30″, the enclosure can be arranged with a height ofup to about 130.5 mm, a width of up to about 445 mm and a depth,including all hardware and fascias, but excluding cable management, ofup to about 635 mm, with the depth from the front-most point of a fasciato a rear I/O connector panel of a rear mounted Field Replaceable Unit(FRU) of about 610 mm. Of course, other examples designed for otherracking systems could have different dimensions.

[0051] This example of a shelf 41 has a single enclosure, or housing, 47that houses a number of modular units or subsystems, the majority ofwhich are replaceable in the field and are therefore known as FieldReplaceable Units (FRUs). These modular units include the informationprocessing cartridges 43.

[0052] The shelf enclosure 47 can be fabricated from sheet material(e.g., from steel sheet) to form a chassis portion 49 that includes abase 51, two sides 53 and 55, a front 57 and a rear 59. The word “front”as used here is merely used as a label herein to refer to the face, orwall 57 of the enclosure that is located at the main access side of therack system 31 in use when the shelf is mounted therein. Similarly, thewords “rear” and “side” are merely used as labels herein to refer to thefaces, or walls 59, 53 and 55 that, in use, are located at thoserespective positions when the shelf is mounted in the rack system 31.

[0053] The openings 45 can be formed in the front face 57 for receivingthe information processing cartridges 43 and, as will be explainedlater, apertures can also be formed in the rear face 59 for receivingfurther FRUs. The enclosure can further include a removable top cover 61that can be secured to the chassis portion 49 by suitable fastening(e.g., screws). The apertures in the front and rear faces 57 and 59allow at least some of the FRUs to be inserted into and/or removed fromthe shelf enclosure 47 via the front or the rear thereof, asappropriate, without removing the shelf from the racking. Access tocomponents mounted in the shelf that are not accessible via one of theapertures in the front 47 and rear 59 faces can be achieved by removingthe shelf enclosure 47 from the racking system 31 and then removing thetop cover 61 of the shelf enclosure 47.

[0054]FIG. 3 is a front view of an example of a shelf 41 for a firstexample. A plastic front bezel 63 can be provided that fits on the frontface 57 (shown in FIG. 2) of the chassis 49 of the shelf enclosure 47.The front bezel 63 can be formed as a unitary removable part that spansthe whole width and height of the front of the shelf enclosure 47. Thefront bezel 63 could alternatively include a number of separatecomponents, or mouldings. The front bezel can include a peripheralportion 64 that can provide areas for corporate and product brandingmarks, for identification and numbering for the information processingcartridge and for a bar code label (all not shown). One or moreapertures 65 can be formed in the peripheral portion 64 of the bezel 63.The apertures 65 in the bezel can be arranged to align with one or moreapertures (e.g. a slot (not shown in FIG. 3) in the front face of thechassis. In use, air can pass through the apertures 65 to flow into theshelf enclosure 47 to reach FRUs that are mounted in the shelf enclosure47 through the rear face 59 thereof. Air flowing through the aperture 65flows into a plenum chamber 66 (not shown in FIG. 3) to flow past theprocessing cartridges 43 to reach rear mounted FRUs. A central area 67of the front bezel 63 can be open allowing access to the openings 45 inthe front face 57 of the shelf enclosure 47 for insertion and removal ofthe information processing cartridges 43. Where no active module ismounted in a location for an information processing module, a blankingpanel, or filler panel, such as the blanking panel 44, can be located inthat location. LED indicators 69 can be mounted on a system indicatorprinted circuit board (not shown) behind a designated area of the bezelto provide an indication of system status via light guides incorporatedinto the bezel. A further system indicator board (also not shown)carrying LED indicators can be provided inside the shelf enclosure to bevisible from the rear thereof.

[0055] As mentioned above, in the present example of a shelf, up tosixteen information processing cartridges 43 can be installed inrespective openings 45 in the front face 57 thereof. The number ofinformation processing cartridges 43 actually installed in anyinstallation is dependent upon the system configuration required.Various features relating to the information processing cartridges 43that are shown in FIG. 3 will be described later.

[0056]FIG. 4 illustrates the rear of the shelf unit of FIGS. 2 and 3.This shows two different types of FRU 71 and 81 (4 units in total) thathave been inserted into respective apertures 72 and 82 in the rear ofthe shelf enclosure 47. The FRUs shown in FIG. 4 include two CombinedSwitch and Service Processors (CSSPs) 71 and two Power Supply Units(PSUs) 81. Various features shown in FIG. 4 will be described later.

[0057] Before proceeding with a more detailed description of each of theFRUs 43, 71 and 81 introduced so far and of the construction of theshelf 41, there follows a brief description of an information processingcartridge 43, a CSSP 71 and a PSU 81 with reference to FIGS. 3, 4, 5, 6and 7.

[0058]FIG. 5A provides a perspective view, partly from the rear, of aninformation processing cartridge 43. FIG. 5B provides a perspectiveview, partly from the front of the same information processing cartridge43. FIG. 5C provides an exploded perspective view of the construction ofthe information processing cartridge 43. Here is it to be noted that theterm “rear” is applied in the context of the position, when installed,of the information processing cartridge, with respect to the shelf 41(i.e. in this case the “rear” of the information processing cartridge 43is the innermost part of the information processing cartridge when it isinserted in the shelf 41). Likewise, “front” refers in the presentcontext to the outermost part of the information processing cartridgewhen it is inserted in the shelf 41.

[0059] With reference to FIGS. 3, 5A and 5B, it will be noted thatinformation processing cartridges are three-dimensional, having a height(h), width (w) and depth (d). If, as in the present example, theinformation processing cartridges are to be arranged in aone-dimensional array (a row) across the shelf, then efficient packingfor the information processing cartridges is achieved where onedimension (here the width, w) is smaller than the other dimensions (herethe depth, d, and the height, h). In a particular example, the enclosureof a processing cartridge 43 has a height h, width w and depth d of 115mm, 26 mm and 315 mm, respectively, although of course, other examplesmay have different dimensions.

[0060] It will be noted that an enclosure 101 of the present example ofan information processing cartridge 43 has six, generally rectangular,faces. For convenience only, the face that is visible from the front ofthe racking when an information processing cartridge 43 is mounted inthe shelf 41 is known as the front face 102. The opposite face is knownas the rear face 103. In the present example these two faces, as well astop and bottom faces 104 and 105, and the side faces 106 and 107 havethe shape of elongate rectangles.

[0061] Although in the present example the information processingcartridges have six generally rectangular faces, it will be appreciatedthat other examples could have other configurations. For example, ratherthan having a generally rectangular shape, the side faces of anotherexample of an information processing cartridge could have the generalshape of a triangle (whereby the information processing cartridge maythen only have five faces), a pentagon (whereby the informationprocessing cartridge may then have seven faces), and so on. Indeed, oneor more or all of the edges could be curved. However, it will beappreciated that the present configuration provides advantages forexample, in terms of manufacturing, engineering and packing densitywithin a shelf 41.

[0062] In this example, the information processing cartridge enclosure101 is fabricated from two housing portions. The first housing portion109 can be fabricated from, for example, a metal (e.g., pressed steel)and can include one side face 107, the rear face 103 and part of the topface 104. The part of the top face formed by the metal portion 109 isgiven the reference 1041 in FIG. 5A. The second housing portion 110 canbe fabricated from, for example, a plastics material and can include theother side face 108 and the front faces 102 and bottom face 105 and theremaining part 1042 of the top face 104. In the present example, aplastics material used is PolyCarbonate Acrylonitrile Butadiene Styrene(PCABS), however many other plastics materials such as other ABSs andnylons may be used. The metal portion 109 also includes a part 1021corresponding to the front face 102 and a part 1051 corresponding to apart of the bottom face 105. The parts are covered by the plasticsportion 110 when enclosure 101 is fully assembled. These parts arevisible in the exploded view of FIG. 5C. The two housing portions 109and 110 are secured to one another by fixings such as screws 118.

[0063] As shown in FIG. 5A, a groove 108 runs along the length of theplastic top face portion 1042. This groove 108 is provided forinterfacing with a guide member of the shelf chassis (not shown in FIG5A, but see FIGS. 8B and 8C). A similar groove 113 is formed in thebottom face 105 of the plastics portion 110 as shown in FIGS. 5B and 5C.This groove 113 is provided for interfacing with a guide member of theshelf chassis (not shown in FIGS. 5B and SC, but see FIG. 8D).

[0064] The provision of the enclosure 101 means that the informationprocessing cartridge 43 can safely be handled by an operator who is nota skilled technician. Also, through the use of the enclosure 101, theinformation processing cartridge is a robust unit that protects itsinner workings from the outside environment and vice versa. The use of aconductive enclosure, e.g., a metal enclosure, can result in theinformation processing cartridge including its own electromagneticshielding. To this end, the enclosure 101 can also be provided with aninternal electromagnetic interference (EMI) shielding member 116 asshown in FIG. 5C. The EMI shielding member can be located between theinternal components 112 of the information processing cartridge 43 (notdescribed in detail with reference to FIGS. 5A to 5C, but see FIGS. 11and 18 below) and the plastics portion 110. The EMI shielding member canbe secured to the plastics portion 110, for example by heat bonding oran adhesive. In other examples, the plastics portion could have aconductive layer deposited thereon, or conductive plastics materialcould be used. In this example, the EMI shielding member 116 is providedwith electromagnetic interference (EMI) fingers 114 to ensure goodcontact with the shelf chassis and the adjacent components. Thesefingers 114 extend through EMI finger apertures 1141 in the plasticsportion 110.

[0065] As shown in FIGS. 3, 5B and 5C, the information processingcartridge 43 incorporates an injector/ejector handle 111 on the frontface 102 for facilitating insertion and latching of the informationprocessing cartridge 43 within an aperture in the shelf 41.

[0066] As shown in those Figures, the handle 111 of the injector/ejectorlever extends substantially the whole height of the front face of theinformation processing cartridge 43, thereby increasing the mechanicaladvantage and facilitating injection and ejection of the informationprocessing cartridge 43. As is further shown in those Figures, the frontface 102 of the information processing cartridge 43 has perforations115, in the present example slits, to allow for airflow into theinformation processing cartridge 43. The front face part 1021 of themetal portion 109 has perforations corresponding to those in the frontface 102 such that airflow into the information processing cartridge 43is not impeded. It will be noted in FIGS. 3, 5B and 5C that the handle111 is narrower in its middle than at its ends. This reduces any maskingeffect of the handle 111 on the airflow to the perforations 115 in thefront face of the information processing cartridge 43 and facilitatesgrasping of handle 111. The handle 111 can be bowed out from the frontface of the information processing cartridge to further facilitategrasping thereof and to reduce any masking effect with regard to theperforations. In other examples, the handle 111 could have an openframe-like structure to further facilitate airflow.

[0067] As shown in FIG. 5A, the rear face 103 of the informationprocessing cartridge 43 also has perforations 117 to allow for air to beexhausted from the rear of the information processing cartridge 43. Afan can be located within the enclosure 101 of an information processingcartridge 43. In the present example the fan is a combined radial fan(blower) and heat sink to direct cooling air onto a processor of theinformation processing cartridge, which fan also encourages air movementwithin the enclosure 101. LED indicators 119 (see FIG. 3 and 5B) can beprovided on the front face 102 of an information processing cartridge toindicate whether power is on, whether service intervention is requiredand whether the information processing cartridge 43 can be removed. Aconnector 120, for example a 40 way single connector attachment (SCA-2)connector (a small computer systems interface (SCSI) connector), can beprovided at the rear of the information processing cartridge 43 forelectrical connection of the information processing cartridge 43 withinthe shelf 41. The connector 120 is advantageously able to withstandrepeated removals and insertions of the enclosure 101 from and into ashelf 41. The connector arrangement can include a guide pin arrangementto prevent module misalignment during insertion of the informationprocessing cartridge into the receiving location.

[0068] Thus an example of features and the construction of aninformation processing cartridge enclosure has been described. Althoughparticular materials and constructions have been described, it will beappreciated that other examples could be employed. Indeed, it will beappreciated that this particular example relates to only a possible formfor the processing cartridge 43. An example of an alternativeconstruction will now be described with reference to FIG. 5D.

[0069]FIG. 5D provides a perspective view, partly from the rear, of analternative information processing cartridge 43. Here is it to be notedthat the term “rear” is applied in the context of the position, wheninstalled, of the information processing cartridge, with respect to theshelf 41 (i.e. in this case the “rear” of the information processingcartridge 43 is the innermost part of the information processingcartridge when it is inserted in the shelf 41).

[0070] In this example, the information processing cartridge enclosure101 is fabricated from pressed steel to form two chassis portions. Thefirst portion 234 includes one side face 107, and part of each of thefront and rear faces 102 and 103 and the top and bottom faces 104 and105. The second portion 235 includes the other side face 108 and theremaining part of each of the front and rear faces 102 and 103 and thetop and bottom faces 104 and 105. The two chassis portions 234 and 235meet at a groove 236 and are secured to one another by fixings (e.g.,one or more screws, not shown). Grooves 236 run along the top and bottomfaces 104 and 105 of the enclosure 101 and are provided for interfacingwith guide rails of the shelf chassis 49 (not shown in FIG. 5, but seeFIG. 8C). A cover portion that is secured to the chassis portion formsthe other side face 106. It will be appreciated however, that in anotherexample, the chassis portions could be joined at a position other thanthe groove 108, with the groove 108 being formed entirely in one of thechassis portions. Alternatively, the enclosure 101 may be constructedfrom a number of sheets of steel, with each sheet forming one of thefaces.

[0071]FIG. 6 provides a perspective view, partly from the front, of aCombined Switch and Service Processor (CSSP) cartridge (or CSSP) 71.Here is it to be noted that the term “front” is applied in the contextof the position, when installed, of the CSSP cartridge 71, with respectto the shelf 41 (i.e. in this case the “front” of the CSSP cartridge 71is the innermost part of the CSSP cartridge 71 when it is inserted inthe shelf 41).

[0072] With reference to FIGS. 4 and 6, it will be noted that a CSSPcartridge 71 is three-dimensional, having a height (h), width (w) anddepth (d). In a particular example, the enclosure of a CSSP 71 has aheight h, width w and depth d of 43 mm, 202 mm and 278 mm, respectively,although of course, other examples may have different dimensions.

[0073] An enclosure 121 of present example of a CSSP cartridge 71 hassix, generally rectangular, faces. For convenience only, the face thatis visible from the rear of the racking when a CSSP cartridge 71 ismounted in the shelf 41 is known as the rear face 122. The opposite faceis known as the front face 123. In the present example these two faces,as well as side faces 126 and 127 have the shape of elongate rectangles.The top and bottom faces 124 and 125 are also rectangular, but notelongate in the manner of the front, rear, top and bottom faces.Although in the present example the CSSP cartridges have six generallyrectangular faces, as for the information processing cartridges 43 itwill be appreciated that other examples could have other configurations.

[0074] In this example, the CSSP enclosure 121 is fabricated from steelsheet to form a chassis portion that includes the bottom face 125, thefront and rear faces 122 and 123 and the side faces 126 and 127. A coverportion that is secured to the chassis portion forms the other top face124. The cover portion is secured to the chassis portion by suitablefixings, for example one or more screws 128. It will be appreciatedhowever, that in another example, other faces, or portions, of theenclosure could form the chassis and the cover portions. The provisionof the enclosure 121 means that the CSSP cartridge 71 can safely behandled by an operator who is not a skilled technician. Also, throughthe use of the enclosure 121, the switch cartridge is a robust unit thatprotects its inner workings from the outside environment and vice versa.The use of a conductive enclosure, e.g., a metal enclosure, means thatthe CSSP cartridge includes its own electromagnetic shielding. To thisend the CSSP enclosure 121 is provided with EMI fingers 129 to ensuregood contact with the shelf chassis and the adjacent components.

[0075] As shown in FIG. 4, the CSSP cartridge 71 incorporates twoD-shaped handles 132 to facilitate insertion and removal of the CSSPcartridge 71 with respect to an aperture 72 in the rear face of theshelf enclosure. A latch member 131 can be pivotably mounted on a platethat can be secured (e.g., using screws) to the rear face of the shelfenclosure. The latch member 131 is configured to engage one of thehandles 132 and to secure the CSSP cartridge 71 in place. In otherexamples, the CSSP cartridge 71 could be provided with aninjector/ejector handle in a manner similar to the informationprocessing cartridge. As shown in FIG. 6, the front face 123 of the CSSPcartridge 71 has perforations 133 to allow for airflow into the CSSPcartridge 71. As shown in FIG. 4, the rear face 122 of the CSSPcartridge 71 has perforations 135 to allow for air to be exhausted fromthe rear of the CSSP cartridge 71.

[0076] At least one fan can be located, for example behind theperforated portion 135 of the rear face, in a CSSP cartridge 71 tochannel cooling air through the CSSP cartridge 71 from the front to therear. In this particular example shown, two fans are provided, onebehind each set of perforations 135. LED indicators 137, as shown inFIG. 4, can be provided on the rear face 122 of the CSSP enclosure 121to indicate whether power is on, whether service intervention isrequired and whether the switch can be removed. Additional link statusindicators can be provided integral to 2×4 stacked RJ-45 connectors 139,also shown in FIG. 4. As shown in FIG. 4, electrical connections 141 canbe provided at the front face of the CSSP (i.e. on the face that in useis inside the shelf enclosure 47). Suitable connections for use in thepresent example include a connector for power connections, a connectorfor serial management data connections and a connector for informationconnections. In the present example, information connections areimplemented using an Ethernet information communication protocol, e.g.at 1 Gigabit (Gb). However other protocols could equally be used, forexample the Infiniband information communication protocol. The connectorarrangement can include a guide pin arrangement to prevent modulemisalignment during insertion of the CSSP module into the receivinglocation. For this purpose, guide pin holes 142 can be provided on thefront face 123 into which guide pins may pass to aid module alignment.

[0077] In the present example, up to two CSSPs 71 can be mounted at anyone time at the rear of the shelf unit in corresponding apertures 72 inthe rear face of the shelf enclosure 47. The number of CSSPs 71 providedin any particular implementation depends upon system configuration andthe need, or otherwise, for redundancy.

[0078] It will be appreciated that one possible construction of the CSSPcartridge 71 has been described and that as for the informationprocessing cartridge 43, other examples could employ other materialsand/or constructions.

[0079]FIG. 7 provides a perspective view, partly from the front, of apower supply unit (PSU) cartridge 81. Here is it to be noted that theterm “front” is applied in the context of the position, when installed,of the PSU cartridge 81, with respect to the shelf 41 (i.e. in this casethe “front” of the PSU cartridge 81 is the innermost part of the PSUcartridge 81 when it is inserted in the shelf 41).

[0080] With reference to FIGS. 4 and 7, it will be noted that PSUcartridge 81 is three-dimensional, having a height (h), width (w) anddepth (d). In this particular example, the order to provide for a densepacking of the FRUs in the rear of the shelf 41, the PSU cartridge 81has two dimensions (hereinafter described as the width, w, and thedepth, d) that are generally similar. In a particular example, theenclosure of a PSU cartridge 81 has a height h, width w and depth d of83 mm, 202 mm and 276 mm, respectively, although of course, otherexamples may have different dimensions.

[0081] An enclosure 145 of present example of a PSU cartridge 81 is ofgenerally oblong shape, but has the “top” “front” edge cut away to forman additional “top” “front” sloping face. The enclosure 145 thereforehas five, generally rectangular, faces and two faces of generallyrectangular shape with one corner cut away. For convenience only, theface that is visible from the rear of the racking when the PSU cartridge81 is mounted in the shelf 41 is known as the rear face 146. Theopposite face is known as the front face 147. In the present examplethese two faces and the two side faces 150, 151 are of elongate,generally rectangular shape with one corner cut away, given that thewidth and depth of the PSU cartridge are similar, whereas the top andbottom faces 148, 149, although still rectangular, are not, in thisexample, notably elongate. A top front face 148 a is present at the topfront of the enclosure. Thus the front of the enclosure is sloped at thetop edge. As for the information processing cartridges 43, however, itwill be appreciated that other examples could have other configurations.

[0082] In this example, the PSU cartridge enclosure 145 is fabricatedfrom steel sheet to form a housing portion that includes the bottom face149, the side faces 150 and 151 and the front and rear faces 146 and147. Cover portions that are secured to the housing portion form the topface 148 and top front face 148 a. The cover portions are secured to thechassis portion by suitable fixings, for example one or more screws 152.It will be appreciated however, that in another example, other faces, orportions, of the enclosure could form the chassis and the coverportions. The provision of the enclosure 145 means that the PSUcartridge 81 can safely be handled by an operator who is not a skilledtechnician. Also, through the use of the enclosure 145, the PSUcartridge 81 is a robust unit that protects its inner workings from theoutside environment and vice versa. The use of a conductive enclosure,e.g., a metal enclosure, means that the PSU cartridge includes its ownelectromagnetic shielding. To this end the PSU enclosure 145 is providedwith EMI fingers 153 to ensure good contact with the shelf chassis andthe adjacent components.

[0083] As shown in FIG. 4, the PSU cartridge 81 incorporates twoD-shaped handles 156 to facilitate insertion and removal of the PSUcartridge 81 with respect to an aperture 82 in the rear face of theshelf enclosure. A latch member 155 can be pivotably mounted on a platethat can be secured (e.g., using screws) to the rear face of the shelfenclosure. The latch member 155 is configured to engage one of thehandles 156 and to secure the PSU 81 in place. In other examples, thePSU 81 could be provided with an injector/ejector handle in a mannersimilar to the information processing cartridge. As shown in FIG. 7, thefront face 147 of the PSU cartridge 81 has perforations 157 to allow forairflow into the PSU cartridge 81. As shown in FIG. 4, the rear face 146of the PSU cartridge 81 also has perforations 159 to allow for air to beexhausted from the rear of the PSU cartridge 81.

[0084] A pair of fans can be located behind the perforated portions 159of the rear face of a PSU cartridge 81 to channel cooling air throughthe PSU cartridge from the front to the rear. LED indicators 161 can beprovided on the rear face 146 of the PSU enclosure 81 to indicatewhether input power is good, whether output power is good, whetherservice intervention is required and whether the PSU can be removed.Electrical connectors 163 can be provided at the front face of the PSU(i.e. on the face that in use is inside the shelf enclosure 47) forconnection to the shelf. The PSU 81 of the present example may suitablyemploy an SSI-MPS (Server Systems Interface Midrange Power Supply)compliant right angle connector at the front face 147 of the PSU 81 toconnect to the shelf 41. The power inlet 83 for each PSU 81 canincorporate a cable/connector retention mechanism (not shown) on therear face 146 of the PSU to prevent accidental or malicious removal ofthe power input cord from the PSU 81.

[0085] In the present example, the shelf unit enclosure provides slotsat the rear of the shelf unit for two hot-swappable, AC input PSUs 81.To provide redundant power supply, both PSU slots are populated. Moregenerally, N+M power supplies can be provided, where N is the minimumnumber of power supply units needed to support the components mounted inthe shelf, and M is a selectable number of 0, 1 or more power suppliesto provide for redundancy. In the present example, N=M=1.

[0086] It will be appreciated that one possible construction of the CSSPcartridge 71 has been described and that as for the informationprocessing cartridge 43, other examples could employ other materialsand/or constructions.

[0087] If the full complement of information processing cartridges orswitches are not fitted to the enclosure, then blanking panels/modules(e.g., the blanking panels 44 shown in FIG. 3) are fitted to allunpopulated positions to maintain the correct airflow and thermalcharacteristics of the shelf, a safe internal operating temperature forthe shelf life expectancy of all shelf components, electromagneticcompliance (EMC) containment and electrostatic discharge (ESD)containment.

[0088] It will be noted that each of the FRUs, such as the informationprocessing cartridges 43, is advantageously contained in its own robustenclosure to facilitate EMC containment, ESD containment, handling,storage and transportation. Each FRU can be configured as a ‘sealed’unit in the sense that it can be configured not to have field orcustomer serviceable parts internally. The FRUs can be configuredreadily to plug into the shelf enclosure and to be hot swappable. TheFRUs can be keyed to prevent incorrect positioning and insertion intothe shelf enclosure and are arranged positively to be retained in theshelf by a latching/locking mechanism.

[0089] The examples of FRUs described above are not provided withremovable media. In the present example, internal data storage isprovided by 2.5″ IDE 9.5 mm or 12.7 mm profile hard disk drive (HDD)devices mounted internally in each information processing cartridge 43and in the CSSP cartridge 71. The drives are not considered as FRUs andare not hot-swappable disk drives in the present example, although theycould be in other examples. In other examples, the informationprocessing cartridges can be configured without internal hard diskdrives.

[0090] The internal configuration of the shelf 41 and a midplane 171contained therein is described in the following with reference to FIGS.8A, 8B 8C and 8D, and FIGS. 9A, 9B and 9C.

[0091]FIG. 8A is a schematic plan view showing the internalconfiguration of an example of a shelf 41 with the cover 61 removed.FIG. 8B is a schematic perspective view from above the rear of thechassis portion 47 of the shelf enclosure with the field replaceableunits removed. FIG. 8C is a schematic perspective view from below thefront of the chassis portion 47 of the shelf enclosure with the fieldreplaceable units and the base 51 removed. FIG. 8D is a schematicperspective view from the front and above a part of the base 51 of theshelf 41. FIGS. 9A, 9B and 9C are, respectively, front, top and rearviews of the midplane 171. In this example, the midplane is, in use,mounted vertically within the shelf 41 extending across the width W ofthe shelf 41 at a position approximately half way between the front andthe rear of the shelf 41.

[0092] The vertically mounted midplane 171 extends, in this example,across the shelf 41 and allows for the electrical interconnection of theFRUs. The various apertures in the front and rear faces 57 and 59 of theshelf 41, in combination with the midplane 171, can be provided withguides (e.g., rails 181) and keying e.g., offset connector positioningfor the insertion of the FRUs into the enclosure and midplane 171. Themidplane 171 can be a double-sided, or multi-layer printed circuit board(PCB) assembly that can be mounted vertically in a rigid manner withinthe enclosure. It can carry connectors 175 on a front surface 172 formaking electrical connection with corresponding connectors 120 on theinformation processing cartridges 43. It can also carry connectors 177and 179 on rear surface 173 for making electrical connection withcorresponding connectors 141 and 163 on the CSSPs 71 and the PSUs 81,respectively. Conductive tracks (not shown) on and through the midplane171 can be provided to interconnect the various connectors. In addition,the midplane can provide connectors for receiving correspondingconnectors connected to first and second indicator boards 183 and 184that each carry a respective set of LED indicators 69. In the presentexample, the midplane 171 is not configured as a FRU and is not hotswappable. It is perforated to facilitate airflow through the shelf 41.The midplane 171 can include openings 185, which cooperate with openingsin the enclosures of the FRUs 43 and 81, to provide a path for coolingair to pass from the front to the rear of the shelf 41, the cooling airbeing driven by fans in one or more of the FRUs, for example in the PSUs81, possibly also in the information processing cartridges 43.

[0093] A plenum chamber floor member 94 can extend horizontally from thefront of the midplane 171 to the front face 57 of the shelf enclosure,or chassis 47. The member 94 provides a floor for a plenum chamber 66,which is supplied with air via the apertures 65 in the front bezel and,in the illustrated example, the slot shaped aperture 68 in the frontface 57 of the shelf enclosure 47. Although, for reasons of ease ofillustration a slot shaped aperture 68 is shown, a plurality ofapertures 68 aligned with the blade receiving locations may be provided.The aperture or apertures 68 can serve both as air vents for a flow ofair to the plenum chamber 66, and also as latching locations forlatching portions at the top of the injector/ejector levers 111 for theblades shown in FIGS. 5B and 5C. The top and sides of the plenum chamberare provided by the top cover 61 and side faces 53 and 54 of the shelfenclosure 47.

[0094] A plurality of cartridge guides 97 can be provided at theunderside of the plenum chamber floor member 94. In the present example,these guides comprise sprung wire members, e.g., of a resilient metalsuch as spring steel, that are attached to the top surface of the plenumchamber floor member 94 and extend through a plurality of aperturestherethrough to result in a row of guides 97 at the underside of theplenum chamber floor member 94. This arrangement is shown in FIGS. 8Band 8C. In FIG. 8B, the sprung wire members 98 are shown attached to thetop surface of the plenum chamber floor member 94. In the presentexample, the sprung wire members 98 are arranged in pairs, such that twoguides 97 are provided by each spring clip 98. In FIG. 8C, the guides 97formed by the protruding portions of the sprung wire members 98 areshown at the underside of the plenum chamber floor member 94. Each guide97 is advantageously positioned so as to interface with the groove 108in the plastics material in the upper face 104 of a processing cartridge43 as shown in FIGS. 5A-5C to aid correct alignment and to facilitateinsertion of the processing cartridge during insertion of the cartridgeinto the shelf 41. The use of the spring clip as a guide 97 also servesto urge the processing cartridge downwards to provide a secure mountingof the processing cartridge 43, to take account of manufacturing andoperational tolerances and to assist in insertion of the processingcartridge where an operator does not align this absolutely correctly.

[0095] A further row of cartridge guides 99 can be provided at the uppersurface of the base 51 of the shelf 41. In the present example, as shownin FIG. 8D, these guides 99 have a rail like form, which can be achievedby punching or stamping through the base 51 of the shelf 41. In thisexample each guide, or rail, 99 includes a pair of upstands separated byan aperture 100 through the base 51. The size of the aperture 100 cancorrespond to the width between the upstands. The separation of theupstands is selected so that the overall width of the resulting rails isslightly less than the width of a groove formed in the lower face of aninformation processing cartridge 43. Thus, each guide 97 isadvantageously arranged so as to interface with the groove 1113 in theplastics material in the lower face 104 of a processing cartridge 43 asshown in FIGS. 5A-5C to aid correct alignment and to facilitateinsertion of the processing cartridge during insertion of the cartridgeinto the shelf 41.

[0096] In the present example, where the guides 97 and 99 are formedfrom metal, the provision of the grooves 108 and 113 in plasticsmaterial at the upper and lower faces, respectively, of each informationprocessing cartridge 43 (see FIGS. 5A-5B) results in a combination ofmetal and plastics materials that can provide a low frictioninteraction, facilitating insertion of the information processingcartridges.

[0097] If, for example, the information processing cartridge enclosureis made of a metal, it may be undesirable to provide metal guides toavoid a metal to metal interaction. In such a case, for example, it maybe desirable to form the guides from a plastics material having a lowcoefficient of friction, such as polytetrafluoroethene (PTFE) orpolythene. Plastics rails could be attached to the underside of theplenum chamber floor member 94 and/or on the upper surface of the base51 of the shelf 41. In such an example, grooves on the upper and lowerfaces of the information processing cartridges 43 could then be formedof metal or plastics and still result in a low friction arrangement.

[0098] A CSSP/PSU divider 96 can be provided to the rear of the midplane171 and can extend horizontally to the rear face 59 of the shelfenclosure 47. The CSSPs 71, when inserted, are supported by the divider96. To aid the correct insertion of the CSSPs 71, CSSP guide pins 178are provided on the midplane 171 at positions adjacent connectors 177 onthe midplane 171 for connection to the CSSPs 71.

[0099] Respective positions 88 and 89 can be formed in the front face 57and the rear face 59 at which first and second indicator boards 183 and184 supporting the indicator LEDs 69 can be located. These positions 88,89 therefore include an aperture through the respective face of theshelf enclosure 47 such that indicator LEDs 69 mounted onto a circuitboard attached to the inside of the shelf enclosure 47 may be viewedfrom outside the shelf enclosure.

[0100] There now follows are more detailed description of the midplane171.

[0101] As mentioned above, the midplane 171 connects all the elements ofa shelf together, including, in the present example, up to sixteeninformation processing cartridges 43, up to two CSSPs 71, two PSUs 81and the two indicator boards 183 and 184. In the present example, due toits location within the shelf enclosure, the midplane 171 is notconfigured to be swappable. Accordingly, to maximize the systemreliability, the midplane is configured to provide as a high level ofreliability as possible. To this end, the midplane is advantageouslyconfigured without active devices and to include the minimum number ofdecoupling capacitors consistent with good design practice (ideallyzero).

[0102] The midplane supports a number of paths for various power andsignal lines to interconnect the FRUs.

[0103] In the present example, each information processing cartridge 43has a high speed information signal connection (e.g., a Gigabit (Gb)Ethernet SERializer/DESerializer (SERDES) connection) to each of theCSSPs 71, each connection consisting of two pairs of differentialsignals. In a conventional manner therefore, the tracking of the pathsfor these signals is arranged to keep the pairs well balanced and on asingle signal layer (i.e. without vias) to support such differentialsignals at high frequency.

[0104] In addition, in the present example, each information processingcartridge 43 has a serial console connection to the CSSP cartridge 71.Each connection consists of two TTL (Transistor-Transistor Logic) levelsignals that make a transmit and return (TX and RX) pair.

[0105] Also, each PSU 81 has a management signal connection (e.g., aserial I2C (Inter-IC Bus) connection) to the CSSP cartridge 71 tocontrol power and monitor environmental parameters. The I2C buscomprises of two signals SCL and SDL (serial clock line and serial dataline). In addition, an I2C address programming pin is provided for thePSUs 81.

[0106] Each information processing cartridge 43 and PSU 81 can signal tothe CSSP cartridge 71 that it is inserted by pulling to ground (GND) arespective Inserted_L signal (i.e., an active low signal). These signalsare fed to the CSSP cartridge 71 via the midplane 171.

[0107] Each PSU 81 has five 12 Volt output rails. The routing from eachPSU 81 is arranged so that a fault in any single FRU cannot completelyinterrupt the power to any other.

[0108] As mentioned above, the midplane 171 is provided with appropriateconnector arrangements for receiving the connectors on the FRUs.

[0109] In the present example, the information processing cartridge 43connects to the midplane 171 through a 40 pin Single ConnectorAttachment (SCA-2) connector as defined by the Small Computer SystemsInterface (SCSI) standard. Accordingly, the midplane carriescorresponding connectors 175.

[0110] In the present example, each CSSP cartridge 71 connects to themidplane 171 through a two right-angle 20 pair connector (e.g., 2 mmHM-Zd connectors available from Tyco Electronics). The correspondingconnectors 177 on the midplane are straight male parts with a powerconnector. A guide pin arrangement is provided in addition to theconnectors to prevent misaligned modules causing bent pins duringinsertion. The guide pin also provides a leading ground. The CSSPcartridge 71 also connects to the midplane 171 through a right-angled125 way 5 row 2 mm connector. The connector 177 on the midplane 171includes a straight male part. A guide pin arrangement is provided inaddition to the connectors to prevent misaligned modules causing bentpins during insertion.

[0111] In the present example, as mentioned above, each PSU 81 connectsto the midplane 171 through an SSI-MPS specification connector. Thecontacts are configured 5P/24S/6P with sequenced signal (S) and power(P) pins. Where the connector on the PSU is a 1450230-1 R/A male header,solder tails connector, the mating connector 179 on the midplane can bea 1450540-2 vertical receptacle, press-fit connector.

[0112] In the present implementation, indicator boards 183 and 184 (seeFIG. 8A) are provided at the front and rear of the system and areconfigured as FRUs. In this example they hold three system-levelindicator LEDs 69 and include a FRU identity (FRU-ID) programmableread-only memory (PROM) each. Three LEDs 69 are present on the indicatorboard. There can, for example, be a white locator LED that can beswitched by the user for locating the system; a green power-on LED toindicate when the system is powered; and an amber service-required LEDto indicate a fault or other condition requiring servicing. These LEDscan be driven by the CSSP 71.

[0113] In the present example, identification information (FRU ID) forthe midplane 171 is held on an I2C electrically erasable programmableread only memory (EEPROM) in the front indicator board 183. In additionto the I2C signals necessary to access the FRU ID EEPROM, the CSSPs 71provide a current limited supply to the indicator boards 183 and 184 viathe midplane. The indicator boards 183 and 184 are also provided with anI2C address programming pin. Depending on the implementation, FRU IDinformation can be stored instead, or in addition, on the rear indicatorboard 184.

[0114] As the FRU-ID for the midplane 171 is held on one or both of theindicator boards 183 and 184, the midplane can be a totally passiveunit. The FRU-ID PROMs communicate with the CSSPs 71 via an I2C bus.Each device on the bus has a separate I2C address. The lower three I2Caddress bits of the EEPROMs used are available as pins on the device, toallow programming with resistors. The least significant bit of thisaddress (A0) is passed to the midplane via the corresponding connector.This allows the midplane 171 to program the address of the FRU-IDdifferently for the front and rear indicator boards 183 and 184, bypulling the address low for the front board and high for the rearindicator board 183. This ensures that both EEPROMS are available on thebus, at different addresses. The FRU-ID for the midplane can be storedon either front or rear EEPROM, but the present example the FRU-ID isstored in the EEPROM on the front indicator board 183. The EEPROM can be8 kByte or larger.

[0115] As mentioned above, the midplane 171 includes openings 185 toprovide a ventilation path for cooling air passing through the shelf 41.The cooling air passing through the shelf 41 via the midplane 171 can bedriven by means of fans provided in each of the information processingcartridges 43 and the power supply modules 81. The openings 185 shown inFIGS. 8B, 9A, 9B and 9C form schematic representations of openings inthe midplane 171. In practice, the openings could have any form (i.e., aseries of large openings, or a number of small perforations), arrangedon the midplane to align with corresponding openings or ventilationapertures in the various field replaceable units 43, 71 and 81. In thisway, the path of the airflow from the front of the shelf to the back ofthe shelf can be configured to be as efficient as possible, depending onthe detail configuration of the fan units and the ventilation openingsor apertures in the information processing, switch, service processorand power supply unit modules 43, 71 and 81. Providing the fan units inthe field replaceable units 43, 71 and 81, contributes to the aim ofmaintaining the chassis 49 and the midplane 171 of the shelf 41 free ofactive components, thereby minimising cost, and facilitatingmaintenance. Also, by providing the fan units in each of the fieldreplaceable units, merely inserting and removing field replaceable unitsautomatically adapts the flow of cooling air to the number and type offield replaceable units inserted in the shelf 41.

[0116] As described above, in the present example each of the FRUs isdesigned to be a non-user serviceable unit. Thus each FRU presents theuser with a “sealed” unit which may be inserted into and removed fromthe shelf 41 as desired or required. If a FRU ceases to be operable,then the user has a choice only of returning the FRU to a supplier orservice company for repair or of discarding the non-operable unit. Asthe FRUs are non-user serviceable, there is no requirement for a skilledtechnician to be employed in inserting or removing the FRUs into or froma shelf 41. Thus each FRU is designed such that a non-skilled personshould have difficulty in causing damage to the FRU during handling.Moreover, the configuration and construction of the FRUs (e.g., theinjector/ejector levers, the grooves in the enclosures of theinformation processing units, etc), of the shelf enclosure and themidplane (e.g., the guide rails to guide insertion of the FRUs, thelocating pins, etc) contribute to facilitating easy insertion andremoval of the FRUs.

[0117] Shown in FIG. 10 is an example of the flow of cooling air throughthe shelf 41 and FRUs 43, 71, 81 mounted therein.

[0118] In this example, the cooling air passing through the shelf 41 isdrawn generally in a front to rear direction through the shelf 41 bycooling fans mounted within the CSSPs 71 and the PSUs 81. Two separateflow paths for cooling air are provided in this example. The first,indicated as flow path αα by dotted lines 77 provides cooling air to theCSSPs 71. The second path, indicated as flow path γγ by dotted lines 78provides cooling air to the information processing cartridges 43 andPSUs 81.

[0119] The flow of cooling air along path a enters the shelf 41 throughthe aperture(s) 65 in the front face 57 of the shelf enclosure 47 intothe plenum chamber 66. Further apertures (not shown) could also beprovided in the side faces 53 and 55 of the shelf enclosure 47 to allowair to flow into the plenum chamber 66. This air then flows through theplenum chamber 66, and passes over the top edge of the midplane 171 toreach the perforations 133 of the front face of the CSSPs 71. Thecooling air then passes through the CSSPs 71, providing cooling to thecomponents thereof before passing out of the CSSPs 71 through theperforations 135 in the rear face of the CSSPs 71 thus being exhaustedfrom the shelf 41. This flow of cooling air along flow path αα is drivenby fans 79 mounted within the CSSPs 71. In the present example, a pairof fans 79 is provided within each CSSP 71 and is mounted against therear face thereof.

[0120] Air flowing along path αα is impeded from flowing around theprocessing cartridges 43 by plenum chamber floor member 94 and isimpeded from flowing to the PSUs 81 by CSSP/PSU divider 96. This flowpath αα therefore ensures that air flowing to the CSSPs 71 is not warmedby passage though the processing cartridges 43 and therefore providesmaximum efficiency cooling to the CSSPs 71.

[0121] The flow of cooling air along path γγ enters the shelf 41 throughthe perforations 115 in the front face of the information processingcartridges 43. The air thus enters the information processing cartridges43 and provides cooling to the components thereof. Cooling fans (notshown) within the information processing cartridges 43 direct thecooling air to the processor (CPU) of the information processingcartridge and direct the flow of air in the cartridge thereby increasingcooling efficiency. The air then exits the information processingcartridges 43 through the perforations 117 in the rear face thereof. Theair then passes through the apertures 185 through the midplane 171 toreach the PSUs 81. This cooling air then passes though the perforations157 on the front and upper front faces of the PSUs 81 to enter the PSUsand provide cooling to components thereof. It will be appreciated fromFIG. 10 that the sloping rear of the upper face of the PSUs 81 increasesthe area over which air can be drawn into the PSUs, thereby reducing theback pressure on the air flowing through the shelf unit and aiding thecooling efficiency. The flow of cooling air along path γγ is driven byfans 85 mounted within the PSUs 81. In the present example, a pair offans 85 is provided within each PSU 81 and are mounted against the rearface thereof.

[0122] Air reaching the PSUs 81 via path γγ will already have passedthrough the processing cartridges 43. Such air will therefore be alreadywarmed above the ambient temperature outside of the shelf 41 by itspassage through the processing cartridges 43. However, as the coolingrequirement of the PSUs 81 is typically less than that for the CSSPs 71,this does not cause any difficulty in the operation of the PSUs 81,which are adequately cooled by this flow of pre-warmed air. Thepre-warmed air passing through the apertures 185 through the midplane171 is impeded from flowing into path αα and entering the CSSPs 71 bythe SCCP/PSU divider 96.

[0123] As will be appreciated by the skilled addressee, the arrangementshown in FIG. 10 is illustrative only and other arrangements whereby,for example, a mixture of cool air from the plenum chamber 66 and warmedair from the processing cartridges 43 is provided to each rear-mountedFRU can readily be constructed.

[0124] With reference to FIG. 11, there now follows a description offunctional elements of an information processing cartridge 43 ascontained within the information processing cartridge enclosure 101.

[0125] The information processing cartridge 43 includes a microprocessor192 (a non-limiting example of a microprocessor that can be utilised inthe present example is an UltraSPARC™ processor). The microprocessor ismounted on an information processing cartridge motherboard 191.

[0126] A configurable clock generator 193, configured as a programmableclock synthesizer employing a crystal, can be used to produce CPU clocksignals, CLKA and CLKB. The clock frequency can be determined by jumpersettings (not shown). A vectored interrupt controller (I-Chip) 194 and aconfigurable core voltage regulator module (VRM) 195 are provided.

[0127] In the present example, memory means for use by the processor 192when executing instructions can be provided in the form of buffereddynamic random access memory (DRAM), for example configured as dual inline memory modules (DIMMs) 196 with a 72-bit data path with errorcorrection codes (ECC), seated in two sockets on a riser card from theinformation processing cartridge motherboard 191. The memory capacitycan be chosen to suit the processor addressable memory space. Forexample, in the present example, up to 4 Gigabytes (4 GB) of addressablememory can be provided. Serial Presence Detect (SPD) auto-configurationis provided via a Service Management Bus (SMBus) over an I2C bus 197.

[0128] In the present example, a PCI bus architecture can be employedwith a so-called SouthBridge bus bridge 199 with SuperIO and two GbEthernet Media Access Control (MAC) devices. As described above,however, other bus protocols (e.g., Infiniband) can be used. A 32 bitPCI bus 198 can be provided from the microprocessor 192. The SouthBridge199 is a standard form of bus bridge, in the present example packaged ina 352 pin PBGA (Plastic Ball Grid Array) package, that provides thefollowing functions: an SM Bus interface over the I2C bus 197 for accessto the SPD (Serial Presence Detect) feature of the DIMMs that allowsinitialization of the memory controller; an Xbus interface for accessvia an Xbus 200 (which is a packet switched multiprocessor bus) to aPROM 201, a real time clock (RTC) 202 and an information processingcartridge service controller (hereinafter termed a Blade ServiceController (BSC)) 203; an IDE (Integrated Drive Electronics) interfacethat provides an ATA-100 (AT Attachment) IDE connection 204 to an IDEdisk drive 205; and a serial console interface on a service bus 206 tothe BSC 203 that is used for operating system functions including aconsole function with this embodiment.

[0129] For IO to the midplane 171, two AC-coupled Ethernet interfaces207 and 208 are provided in the present example, which are packaged in a316 pin PBGA. These Ethernet interfaces can provide a PCI attachedEthernet MAC capable of operation up to Gigabit Ethernet performance.The physical layer can be implemented using SERializer/DESerializers(SERDESs) 209 and 210. An example of a SERDES device is the TLK2201transceiver manufactured by Texas Instruments, Inc. The SERDES devicesuse differential PECL TX+/− and RX+/− (Positive Emitter Coupled LogicTransmit and Receive) pairs to communicate to the switch portions of theCSSPs 71 over the midplane 171. The RX+/− pairs can be AC coupled at theinformation processing cartridge 43, the TX+/− pairs can be AC coupledat each CSSP 71. This facilitates hot-swap of the information processingcartridges 43 and the CSSPs 71.

[0130] Asynchronous serial connections 211 and 212 for communicationbetween the BSC 203 and the Service Processor parts of the CSSPs 71 canbe provided.

[0131] Internal data storage can be provided in the present example by ahard disk 205 with a capacity of 30 GB or more rated for 24/7 continuousoperation. The hard disk 205 is accessed using the primary IDE interfaceof the SouthBridge 199. The hard disk 205 can hold an operating system,for example a Solaris operating system, and other software and data forperforming information processing using the main, or host, processor(CPU) within the information processing cartridge 43.

[0132] In the present implementation, the BSC 203 can be implemented asa microcontroller (e.g., a Hitachi H8 microcontroller). The BSC 203 canprovide various functions, including for example: dual access (for theinformation processing cartridges and the CSSPs 71) to PROM 201 andEEPROM 213 for boot information and a FRU-ID for the informationprocessing cartridge; channelling communication between an informationprocessing cartridge 43 and the service processor part of the CSSPs 71;control of power on reset (POR), system reset and externally initiatedreset (XIR) to the microprocessor 192; control of the power,service-required and ready-to-remove LEDs 69; upgrading offield-upgradable firmware, via the serial interface; a watchdog functionfor the operating system; monitoring the speed of a CPU fan 214; andcommunications with an EEPROM 215 and the operating system via the Xbus200.

[0133] In the present example, the BSC 203 can be powered by a 5Vservice bus (SB) rail as soon as a CSSP 71 and a PSU 81 are fullyinserted into the midplane 171, it then turns on other DC/DC convertersto provide power to the remainder of the information processingcartridge 43. A BSC reset signal can be derived from a simpleconventional power on reset (POR) generator that monitors a 5V supplyrail.

[0134] In the present example a 1 MByte Flash PROM 201 can be providedfor storing boot variables for OpenBoot™ PROM (OBP) andPower-On-Self-Test (POST). Further OBP variables can be stored in asecond 16 kByte (16 kB) I2C PROM 215, accessible via the SouthBridge SMBus port over the IC Bus 197. The PROM 215 can contain 8 kByte for OBPvariables and 8kByte of unused space. A 16 kByte I2C EEPROM 213 that isaccessible via the BSC 203 can contain BSC variables and FRU-IDvariables. The EEPROM is nominally divided into 8 kByte for FRU-ID and 8kByte for the BSC variables. Write protection for the FRU-ID isimplemented by BSC firmware. Such write protection may be carried outby, for example, acknowledging instructions to write to the protectedarea, but not to carry out those write instructions.

[0135] An environmental monitor sensor 215 can be provided to monitorthe CPU and ambient temperatures. This sensor can be accessible via theonboard I2C bus from the BSC 203.

[0136] The information processing cartridge 43 can be powered from two,diode commoned, 9V power supply rails 216 and 217. DC/DC converters 218can be used to provide the voltage levels required by the informationprocessing cartridge 43. The DC/DC converters 218 are supplied by dual9V inputs 216, 217, individually fused 219, 220 and then diode commoned221, 222. A 5V DC/DC converter can be turned on as soon as the FRU isfully inserted, with the BSC 203 and required portions of theSouthBridge 199 being powered (the 5VSB rail). A field effect transistor(FET) can be used to gate off the main 5V supply to the rest of theinformation processing cartridge 43. The DC/DC converter outputs and themain 5V FET can be arranged not to turn on until the BSC 203 turns themon via a signal from the SouthBridge 199. The SouthBridge 199 can beused so that if the BSC 203 is reset (by a watchdog timeout or after afirmware download) the state of the DC/DC converters 218 is notaffected. When the remaining outputs from the DC/DC converters 218 arewithin specification, a PWR_GOOD signal can be asserted low to the BSC203.

[0137] A SouthBridge resume circuit can be operable to run from 3V3, anda simple Zener diode dropper circuit can be used to generate 3V3 fromthe 5VSB supply.

[0138] When the FRU is inserted the inrush current can be limited, forexample to <1A, and the rate of rise can be configured not to exceed apredetermined value (e.g., 20A/s) to provide a so-called soft start tofacilitate hot-insertion. The intent is to prevent damage to theconnectors and to avoid generating noise. A soft start controller 223,which controls a ramping-up of voltage levels, can be enabled when thepredetermined signal (Inserted_L signal) is asserted low, this signal ison a short pin in the connector and is connected to ground (GND—notshown) through the midplane 171.

[0139] In the present example, a processor impingement fan (processorfan) 214 is configured to run at full speed to cool the informationprocessing cartridge 43 and the fan. The speed of the processor fan andsink can be monitored by the BSC 203, using a tachometer sense pin onthe microcontroller. In the event of the fan speed falling below apredetermined speed, or percentage of its nominal speed (e.g., 80%), theBSC 203 can be arranged to issue an alert. The nominal speed of the fancan be recorded as part of the BSC EEPROM contents.

[0140] The midplane connector 120 for the information processingcartridge 43 is used to establish the connection between the informationprocessing cartridge 43 and the midplane. In the present example itsupports up to 84 connections (pins) that will deliver SERDES outputs224, 225, I2C signals 226, 227, and power 216, 217. Signal connectionsmay be made through a right-angled connector. Power connections may bemade through the information processing cartridge right-angledconnector. The connector can be configured to facilitate hotswapping ofthe information processing cartridge, for example by having a lowinsertion force and/or guide pins to increase the ease of serviceabilityand prevent module misalignment during insertion.

[0141] Interrupts to the processor 192 can be encoded using an encodedinterrupt vector mechanism. An I-Chip Emulator (ICE) 228 functions as aninterrupt concentrator, receiving all system interrupts and encodingthem as an interrupt vector according to an interrupt vector codeutilisable by the processor 192. In the present example, where anUltraSPARC™ processor is used, the interrupt vector encoding may bebased on a 6-bit interrupt vector code.

[0142] With reference to FIG. 12, there now follows a description of anexample of a combined switch and service processor (CSSP) 71. In thepresent example, each CSSP 71 provides the functionality of a Switch 73and of a Shelf Service Processor, or Shelf Service Processor (SSP) 74.

[0143]FIG. 12 provides an overview of the functional components of theCSSP 71 including functional components of the Switch 73 and functionalcomponents of the SSP 74. In the present example, most of the componentsrelating to the Switch 73 are mounted on a Switch PCB 231, and thecomponents relating to the SSP 75 are provided on a SSP PCB 232.However, it should be noted that the components located in the lowerportion of the switch PCB 321 (i.e., that portion below the SSP PCB 232as illustrated in FIG. 12 logically belong to the SSP 74, rather than tothe switch 73. It will be appreciated that such component arrangementsare not compulsory for successful operation and that any other componentarrangement over any number of component boards can be easily achievedusing conventional component arrangement techniques.

[0144] Firstly, with reference to FIG. 12, there follows a descriptionof functional elements of the Switch portions 73 of a CSSP 71 ascontained within the CSSP enclosure 121.

[0145] The midplane connector 141 on the CSSP 71 establishes theconnection between the CSSP 71 and the midplane 171. In the presentexample, it supports up to 84 connections (pins) that will deliverSERDES outputs 265-268, I2C signals 310, 320, 321 and 322, and power278, 279. Signal connections may be made through two 20-pairright-angled connectors. Power connections may be made through aright-angled connector. The connector can be configured to facilitatehotswapping of the board, for example with a low insertion force. Theconnector also uses guide pins to increase the ease of serviceabilityand prevent module misalignment during insertion.

[0146] A switch microprocessor 240 is provided, in the present examplethe microprocessor used is a Power PC (MPC8245) packaged in a 352pinTape Ball Grid Array (TBGA) package. This microprocessor 240 supportsbetween 1 MB and 2 GB of address space in the present example. Itfurther includes an Embedded Programmable Interrupt Controller (EPIC)that provides 5 hardware interrupts (IRQs) or 16 serial interrupts.There are 4 programmable timers with cascade mode function. DRAM memoryfor the processor can provided in the present example by a commodityDIMM 242. The processor 240 can be connected to a 32 bit PCI bus 241,which operates at, for example, 33 MHz/66 MHz.

[0147] A clock input to the processor 240 can be provided by a clockgenerator (CLK) 243. The CLK 243 can include a configurable clockgenerator (not shown) implemented as a programmable clock synthesiseremploying a crystal used to produce CPU clock signals. The clockfrequency can be determined by jumper settings (not shown). A vectoredinterrupt controller (I-Chip) (not shown) and a configurable corevoltage regulator module (VRM) (not shown) can be provided that operatesubstantially as described above with reference to the like componentsof FIG. 11.

[0148] In the present embodiment two switch ASICs (application specificintegrated circuits) 244, 245 are provided (in the present example,BCM5632 Gigabit switch ASICs). Each ASIC can provide twelve GMIIInterfaces (1 Gigabit Ethernet) (for uplinks and downlinks) and one 10Gb XGMII interface for chip-to-chip communication (bridging) 246 betweenthe ASICs 244 and 245. Sixteen GMII 1 Gb ‘downlinks’, in the form ofserialized Gb Ethernet data, are provided through four quad SERDES248-251 to allow each information processing cartridge 43 to communicatewith the switch 73. Eight GMII 1 Gb ‘uplinks’ are provided for externalcommunication through two quad PHYs 253 and 254 (in the present exampleBCM5404 ASICs) and RJ45 connectors on the rear panel 122. The ASICs 244and 245 are configured via a PCI interface (32 bit/33 MHz) to the PCIbus 241.

[0149] A Flash PROM 256 can store a real time operating system, andmanagement and configuration data for the microprocessor. The Flash PROM256 in the present example can be operable to hold 8 MB—16 MB of data,depending on the software required. The flash PROM 256 can be operatedvia an on-chip XBus 258.

[0150] Also connected to communicate with the processor 240 via the XBus258, a Real Time Clock (RTC) 259 can be provided for real-time functionswith a back-up battery.

[0151] Also connected to the XBus 258 can be a UART (UniversalAsynchronous Receiver Transmitter) 260 which in turn connects to aserial bus 261 for providing an asynchronous console connection from theswitch 73 to the SSP 74 which can be accessed by the SSP.

[0152] An integrated MAC/PHY (Media Access Control/Physical) switch 271can provides its own interface to the PCI bus 241. This MAC/PHY switch271 can connects to a 10/100 Ethernet hub 272. The hub 272 can beoperable to provide a management interface to the SSP 74 and aconnection from an external management network to the switch 73 and SSP74 of a given CSSP 71. The connection from the integrated MAC/PHY device271 to the SSP 74 can be coupled capacitively. A loopback mode can beprovided by the MAC/PHY device 271 for system diagnostics. The hub 272can connect to an RJ45 connector 273 on the rear panel 122 of the CSSPenclosure 121.

[0153] An 8kByte I2C EEPROM 262 can be used to store the FRU-ID and isaccessible by the SSP portion 74 of each CSSP 71 via a serial bus 263and the midplane 171. The upper 2 kByte of the EEPROM 262 can beconfigured to be write protected.

[0154] An I2C Redundant Control Register (RCR) 275 can be used toprovide an alternate, redundant path for powering-down the CSSP 71 andShelf Level Indicators 69 mounted on the front 57 and rear 59 panels ofthe shelf 41. The I2C RCR 275 can be accessible by both the SSP 74 ofthe CSSP 71 containing the RCR and the SSP 74 of a further CSSP 71connected via the midplane 171 via an I2C bus 276. In the presentexample, a device suitable for use as the RCR 275 is a Phillips PCF8574IC.

[0155] With continued reference to FIG. 12, there now follows adescription of functional elements of the Shelf Service Processor (SSP)portion 74 of a CSSP 71 as contained within the CSSP enclosure 121 andprovided on an SSP PCB 232.

[0156] In the present example, communication between the Switch PCB 231and the SSP PCB 232 is facilitated by an interboard connector pair 298and 299. It supports connections (pins) for I2C signals, 10/100 MAC/PHYoutput, and power. As described above, the switch PCB 231 carries thecomponents associated with the switch, and it also carries the power,FRU-ID and environmental monitoring components along with the connectorsfor connections to the midplane 171 and external connectors. Thus, inthe present example, all SSP components requiring a connection to themidplane 171 or an external connection have signal paths routed throughthe connector pair 298, 299 and via the switch PCB 231 to the relevantmidplane or external connectors.

[0157] In the present example, the SSP 74 includes a microprocessor 301(e.g., a Power PC (MPC8245) processor) mounted on the SSP printedcircuit board (PCB) 232. The processor 301 can be connected to a PCI bus302, the present instance a 32 bit bus that operates, for example, at 33MHz/66 MHz.

[0158] A clock input to the processor 301 can be provided by a clockgenerator (CLK) 303. The CLK 303 can comprise a configurable clockgenerator (not shown) implemented as a programmable clock synthesiseremploying a crystal used to produce CPU clock signals. The clockfrequency can be determined by jumper settings (not shown). A vectoredinterrupt controller (I-Chip) (not shown) and a configurable corevoltage regulator module (VRM) (not shown) can be provided that operatesubstantially as described above with reference to the like componentsof FIG. 11.

[0159] The processor 301 can be provided with a DRAM memory 305. Thememory capacity can be chosen to suit the processor addressable memoryspace. In the present example, 8 MB of DRAM memory is provided.

[0160] An integrated MAC/PHY switch 306 can provide its own interface tothe PCI bus 302. The MAC/PHY switch 271 can be connected to 10/100Ethernet hub 272 via the interboard connectors 298, 299. A loopback modecan be provided by the MAC/PHY switch 306 for system diagnostics.

[0161] Octal UARTs 308 and 309 can be connected between the PCI bus 302and the interboard connector pair 298, 299. The signal path can becontinued from the interboard connector pair 298, 299 to serialconnections 310 on the midplane connector 141 on switch PCB 231. TheOctal UARTS 308, 309 can facilitate serial communications between theSSP 74 and each of the processing cartridges 43.

[0162] Also connected to the PCI Bus 302 can be a dual UART (DUART) 312that in turn can connect via the interboard connectors 298, 299 toserial bus 261 for providing an asynchronous console connection from theSSP 74 to the switch 73. The DUART 312 can also have an I2C connectionto an external connector on the rear face 122 of the CSSP enclosure 121.The external connector can provide a common operating system/bootconsole and command port 311.

[0163] Connected to the processor 301 via an XBus 314 can be a FlashPROM 315. The Flash PROM 315 can store a real time operating system, andmanagement and configuration data for the microprocessor 301. The FlashPROM 315 can be operable in the present example to hold up to 2 MB ofdata, depending on the software required.

[0164] Also connected to the processor 301 via the XBus 214 can be areal time clock (RTC) 316 for real-time functions with a backup battery.The RTC 316 can also provide 8 kByte of non-volatile random accessmemory (NVRAM), in the present instance implemented as an EEPROM. Thiscan be used to contain information such as the FRU-ID, a serial numberand other FRU information.

[0165] To facilitate I2C communications between the SSP 74 and the otherCSSP 71, the midplane 171 and the PSUs 81, a multiplexer 318 can beprovided. The multiplexer 318 can have a single I2C connection to theprocessor 301 and connections, via the interboard connector pair 298,299 and the midplane connector 141 to both PSUs 81, the midplane 171 andthe other CSSP 71.

[0166] The processor 301 can also comprise an embedded DUART to providea redundant serial link to the SSP 74 of the other CSSP 71. Although itwould be possible to implement this link using an external DUART, theadvantage of using an embedded DUART is that the connection to the otherCSSP is reliable and therefore likely to be functional. Where theembedded DUART link does not use the I2C Multiplexer for communicationsto the other CSSP, a common mode of failure for both the SSP—SSP I2Clinks can be avoided, it being assumed that the processor 301 is likelyto be functional even if both embedded DUART channels arenon-functional.

[0167] The CSSP 71 can powered from two, diode commoned, 9V power supplyrails 278 and 279. DC/DC converters 281 can be used to provide thevoltage levels required by the CSSP 71. The DC/DC converters 281 can besupplied by dual 9V inputs 278, 279, individually fused 285, 286 andthen diode commoned 287, 288. A soft start controller 283 can beprovided to facilitate hot-insertion. A 5V DC/DC converter (I2C powerregulator) 282 can be turned on as soon as the CSSP 71 is fullyinserted. A 3.3V DC/DC converter can be turned on when instructed, forexample through SSP service software, by asserting low an appropriatesignal (ON_L—not shown). The 3.3V converter can be arranged to turn on aconverted for 2.5V, 1.2V, and a processor core voltage rail (Vcore) whenthe voltages are within an appropriate range.

[0168] When the CSSP 71 is inserted the inrush current can be limited,for example to <1A, and the rate of rise can be configured not to exceeda predetermined value (e.g., 20A/s) to provide a so-called soft start tofacilitate hot-insertion. The intent is to prevent damage to theconnectors and to avoid generating noise. A soft start controller 283,which controls a ramping-up of voltage levels, can be enabled when thepredetermined signal (Inserted_L signal) is asserted low, this signal ison a short pin in the connector and is connected to ground (GND—notshown) through the midplane 171 until one of the supplies is removed.These circuits can be configured to withstand an overvoltage at theirinputs whilst the input they are feeding is not powered, without anyleakage to the unpowered circuit. A sense circuit can detect if thevoltage has dropped below a threshold, for example 2.0V, as a result ofa blown fuse, a power rail going down, etc. The DC/DC converters 281 canbe protected against short circuit of their outputs so that no damageoccurs.

[0169] The I2C regulator 282 can be powered as soon as the CSSP 71 isfully inserted into the midplane 171. This can be facilitated throughshort pins connected to the soft start controller 283, which controls aramping-up of voltage levels. The other DC/DC regulators can be turnedon, for example by SSP software.

[0170] A pair of fans 290, 291 can provide cooling to the CSSP 71. Thefans 290, 291 can be configured to run at full speed to preventovertemperature conditions by minimizing the temperature of the internalcomponents and the fan. The speed of the fans 290, 291 can be monitoredby the SSP 74 through an environmental monitor 295 on the switch board231. The environmental monitor 295 can be alerted in the event of thefan speed falling below a predetermined value (e.g., 80% of its nominalspeed). The fan can provide tachometer outputs to facilitate themeasurement of fan speed.

[0171] LED indicators 137 can be provided, for example with a greenpower LED, an amber LED for indicating that service is required and ablue LED for indicating that the switch is ready to be removed. LEDindicators integrated on 2×4 stacked RJ45 connectors on the rear face ofthe CSSP 71 can be arranged, for example, to show green continually whenthe link is present and flash green when the link is active.

[0172] The environmental monitor ENV MON 295 can be provided to maintainoperational integrity of the CSSP 71. The ENV MON 295 can include limitvalues in limit registers and can monitor, for example, temperaturewithin the CSSP enclosure 121, the CSSP power rails, including the 12V,3V3, Switch Processor Core Voltage, CSSP Processor Core Voltage and thetwo 9V power feed rails 278, 279 from the midplane 171. The outputs ofthe DC/DC converters 281 can be fed in to A/D inputs of the ENV MON 295for Watchdog comparisons to be made to the voltage limits set in thelimit registers. As noted above, the ENV MON 295 can also monitor theoperating speeds of the fans 290 and 291. The ENV MON 295 cancommunicate with the SSP 74 of both CSSPs via an I2C bus 296.

[0173] For IO to the midplane 171 shown in FIGS. 8A-10, the midplaneconnector 141 can include sixteen 1 Gb Ethernet connections 265-268 fromfour quad SERDES 248-251 and the I2C bus lines 596.

[0174] The SSP 74 can access the I2C devices (FRU-ID EEPROM, 8-bit I/Oexpansion chip, and the system hardware monitor) through the midplane171.

[0175] For external IO, rear panel Gb Ethernet connections can beprovided from the two quad PHYs 253, 254 to 2×4 stacked RJ45 connectors139 (to give 8 uplinks). Each port can be an independent 10/100/1000BASE-T (auto negotiating) port. The PHY devices 253, 254 can operate inGMII mode to receive signals from the 8-Gigabit interfaces on the ASICs244, 245.

[0176] The Power Supply Units (PSUs) 81 can configured such that whentwo or more PSUs 81 are connected in parallel in the shelf 41, failureof any one of the paralleled units shall not affect system operation.Moreover, one of the PSUs can be installed or removed from a “live”system with or without input power applied. The outputs can haveovercurrent protection.

[0177] The PSU can have an I2C interface to provide power supply statusvia the midplane 171. The PSU can have an internal temperature sensorthat reports via the I2C interface. The PSU fan speed can also bemonitored and errors are reported via the I2C interface. Overvoltage andovercurrent sensors can also report via the I2C interface.

[0178] There now follows a description of aspects of an example of apower supply 81 with particular reference to FIG. 13.

[0179] When a power supply (e.g. mains power, or UPS type protectedpower) is connected to the cable connector 83, transformer, regulatorand rectifier circuitry 400 can operate to generate a DC output (in thepresent example, 12V DC) from the input (in the present example 230/240V50 Hz AC or 110V 60 Hz AC).

[0180] In order to ensure good cooling reliability within the shelf 41,each PSU 81 can have a pair of cooling fans 402, 403 located at the rearof the PSU enclosure as described above with reference to FIG. 7. As afailsafe measure against a failure of one PSU 81, the fans of each PSU81 can be powered by both PSUs 81. Thus, in the event that one PSU 81 isnon-operative to produce the DC supply for the shelf 41, as long as theother PSU 81 is operative, not only will all components of the shelf 41be powered as normal, the fans of both PSUs 81 can continue to run.

[0181] As shown in FIG. 13, this dual powering of cooling fans 402, 403can be effected by providing a power supply line 404 from thetransformer, regulator and rectifier circuitry 400 to power both fans402, 403. Also, first and second separate power lines 410, 412 from theother PSU 81 can provide duplicate power supply to the first and secondfans 402, 403 respectively. The fan 402 can thus be powered by a diodecommoned supply from line 404 and a diode commoned supply from line 410.Diode protection can be provided by diodes 405 and 411 respectively. Thespeed of the fan 402 can be controlled by a speed controller 408.Similarly the fan 403 can be powered by a diode commoned supply fromline 404 and a diode commoned supply from line 412. Diode protection canbe provided by diodes 406 and 414 respectively. The speed of the fan 403can be controlled by a speed controller 409.

[0182] The two speed controllers 408, 409 can in turn be controlled by adata input from each CSSP 71 received via an I2C bus connection (notshown in FIG. 13). Power supply lines carrying DC power for the otherFRUs of the shelf 41 are shown in FIG. 13 as power line 416. All powerconnections to and from the PSU 81 can connect to the midplane 171 whenthe PSU is inserted in the shelf 41 via the midplane connector 163. Inthe present example the PSU 81 connects to the shelf through a 5P/24S/6Pconfiguration SSI-MPS compliant right angle connector 163 at the frontface 147 of the PSU 81. Connectors for the I2C interface can also beprovided.

[0183] The input power line 410 and 412 for each fan 402 and 403 can beprovided with a softstart module 4131 and 4132 respectively, to allowfor hot insertion of the PSU 81 into the shelf 41. The softstart modules4131 and 4132 can be controlled, for example, by pulling a signal toground (e.g., a “mated” input line 4151 and 4152).

[0184] Where the two input power lines 410 and 412 are separate lineshaving separate softstart provision, there is no common failure mode forthe backup method of powering the fans 402, 403. Thus even if the PSU 81ceases to be operable to generate the DC supply, and a component (powerline or softstart module for example) fails in the supply path from thesecond PSU 81 to the fans 402, 403, at least one of the fans 402, 403can remain operational as the shelf 41 still receives the cooling effectof three PSU fans.

[0185] In the present example, the power supply has four rear panel LEDindicators 137. A blue “Ready to Remove” LED can be driven by the I2Cinterface and indicate hat the power supply may be removed from thesystem. An amber “Service Required” LED can be driven by the I2Cinterface and indicate that the power supply is in a fault condition:any output out of range, over-temperature or shutdown. A green “DCOutput-OK” indicator can be driven by internal power supply circuits andshow that the main 12 volt supply is functioning. The LEDs can remainlighted when individual outputs are in the current limited mode ofoperation. A green “AC Input-OK” indicator can be driven by internalpower supply circuits and show that AC input power is within normaloperating range.

[0186] With reference to FIG. 14, there will now be described an exampleof data connectivity between the FRUs and midplane of the shelf 41.Power transmission paths are not illustrated in FIG. 14. However, itwill be appreciated that to facilitate the maximum component redundancyof the shelf 41, each PSU 81 can independently provide power to eachFRU.

[0187] In the present example each of the processing cartridges (blades)43 connects to the midplane 171 via a pair of information signalconnections (e.g. Gb Ethernet links) 224, 225 and a pair of serialmanagement signal connections 226, 227. Connections within the midplane171 can ensure that each Ethernet link 224 is directed to a connection265-268 from the midplane 171 to a first switch 73, and that eachEthernet link 225 is directed to a connection 265-268 from the midplane171 to a second switch 73. Thus one Ethernet link can be establishedbetween each processing cartridge 43 and the switch 73 of each CSSP 71.Further connections within the midplane 171 can ensure that each serialconnection 226 is directed to a connection 310 from the midplane 171 tothe first SSP 74 and that each serial connection 227 is directed to thesecond SSP 74. Thus one serial link can be established between eachprocessing cartridge 43 and the SSP 74 of each CSSP 71. As mentionedearlier, information signal connections other than Gb Ethernetconnections (e.g. Infinband connections) could be employed in otherexamples.

[0188] A plurality of serial connections can connect each SSP 74 to theother. Serial lines 320, 321 can connect each SSP 74 to the midplane 171and connections within the midplane can connect the two sets of linestogether. To provide a control interface from the SSPs 74 to the PSUs81, serial lines 322 can connect each SSP 74 to the midplane 171 andconnections within the midplane 171 can connect to serial lines 324 fromthe midplane 171 to each PSU 81.

[0189] An example of data and control connectivity of the shelf 41 toand from computer systems external to the shelf 41 when the shelf 41 isarranged for use within a multiprocessor server system such as thatdescribed above with reference to FIG. 1 will be described withreference to FIG. 15.

[0190] As summarised above with reference to FIG. 14, in the presentexample each processing cartridge, or blade, 43 is connected to theswitch 73 of each CSSP 71 by an information signal connection (e.g. a 1Gb Ethernet link) formed by a combination of links 224, 225 from theprocessing cartridge 43 to the midplane 171, connections within themidplane 171 and links 265-268 from the midplane 171 to each switch 73.

[0191] Further, in this example a set of serial management signalconnections comprising links 320, 321 and connections within themidplane 171 connect the SSP 74 of each CSSP 71 to the SSP 74 of theother CSSP 71.

[0192] To provide external data connectivity between the shelf 41 and anexternal core data network 330, in association with which allinformation processing performed by the processing cartridges 43 of theshelf 41 is undertaken, connections 331 can be formed between the coredata network 330 and the eight 1 Gb Ethernet ports 139 provided on therear panel 122 of the CSSP enclosure 121.

[0193] In the present example, the connections by means of which controland configuration of the shelf 41 are performed are entirely separate tothe connections to the core data network 330. Therefore, a firstexternal switch 335 can connect to a management (I2C) port 273 of thefirst CSSP 71 and a second external switch 336 can connect to amanagement (I2C) port 273 of the second CSSP 72. As described above withreference to FIG. 12, the management port 273 can provide a managementnetwork interface to both the switch 73 and SSP 74 of each CSSP 71. Theexternal switches 335, 336 can each be connected to each of a pair ofSystem Management Server (SMSs) 338, 339. The SMS is not essential tothe operation of the shelf 41, but use thereof aids optimal operation ofthe shelf 41. In a typical multiprocessor server system a plurality ofshelves 41 may be connected together via the core data network 330 underthe control of a single management network utilising one set of SMSs338, 339. A set of SMSs 338, 339 may comprise a single SMS (as well as aplurality thereof). However use of at least two SMSs enables redundancyof components, therefore increasing overall system reliability.

[0194] A serial interface control 343 operable under telnet protocolcontrol is also connected to the shelf 41 in the present example. Thiscan provide a common operating system/boot console connection to the SSP74 of both CSSPs 71 via the RJ45 connector 311 on the rear panel 122 ofeach CSSP enclosure 121.

[0195] It will be appreciated from the above that a flexible andscalable modular computer architecture has been described. In thedescribed example up to 16 information processing cartridges, or blades43, can be configured as sealed FRUs on a single shelf 41, the number ofblades being chosen according to customer requirements. Each blade hasits own processor and random access memory. If, for example, there is amaximum of 2 Gbytes of memory per information processing cartridge, andone processor per blade, 16 processors (16P) with 5.33 processors perunit height (1U) and a total of 32 GB of memory per shelf can beprovided.

[0196] In the present example, the shelf 41 incorporates redundantcombined switch and shelf service processor modules (CSSPs) 71 andredundant power supply units (PSUs) 81 separate from the blades 43. Asthe power supplies are carried by the shelf, the information processingcartridges can be kept compact and inexpensive. Also, as a result, theycan be powered by DC power only, via the midplane 171.

[0197] Also, as mentioned earlier, the FRUs (e.g., the informationprocessing cartridges, or blades, 43, the CSSPs 71 and the PSUs 81) canall be configured as sealed units that do not contain any internal FRUsthemselves and do not contain user serviceable items. The enclosures ofthe FRUs can be arranged to enclose all of the functional components ofthe FRU with only electrical connectors being externally accessible andwith indicator LEDs being externally visible as well.

[0198] These factors can all contribute to keeping the cost of the FRUslow, as well as that of the overall system. The modular approach withthe use of sealed modular field replaceable units for providing systemfunctionality and with non-field replaceable units designed with aminimum possible number of active components enhances reliability.Moreover, easy and rapid maintenance is facilitated in the event of afailure of a FRU by simple replacement of that FRU, further reducing thecost of ownership.

[0199] Thus, it will be appreciated from the above description that theprovision of a rack mountable shelf, that includes power supplies, ashelf service processor and switches in modular units, for carrying anumber of processing cartridges, wherein the number of processingcartridges can be chosen according to customer requirements, provides aflexible and scalable computer configuration. The balancing of the loadbetween the processors of the processing cartridges can be effected bysoftware using conventional principles.

[0200] A configuration as described provides an easily scalableprocessor architecture, whereby the processing power provided by acomplete system based on the information processingcartridge/information processing cartridge carrier architecture can bescalable from moderate to very high capacity through the simple additionof further information processing cartridges.

[0201] As illustrated in FIG. 16, an example of the external connectionsfrom a shelf 41 can be in the form of two active information signalconnections (e.g., Ethernet connections) 350 and 351, two active powerconnections 353 and an active/standby pair of management connections354. With regard to the management connections, each connectioncomprises a serial connection and a network (e.g.

[0202] Ethernet or Infiniband) connection. It is possible to connect toeither the active or the standby connection, as the incoming signal willbe internally routed to whichever management controller (CSSP) is thecurrent master. It will be appreciated, therefore, that the connectionsto a shelf can be kept to a minimum. It will further be appreciated fromthe configuration shown in FIG. 16 that the system is scalable beyond asingle shelf unit 41.

[0203]FIG. 17 illustrates how a plurality of shelves can be configuredwithin one (or more) racks to provide even higher processing power. Sucha constellation of shelves to provide a large grouping of servers issometimes termed a “web farm” or “server farm” 360. As shown in FIG. 17,the web farm comprises a plurality of shelves 41 that each carry aplurality of blades 43. Also provided are a plurality of NetworkAttached Storage devices (NAS) 373 for providing storage for criticaldata, e.g. email data storage, for the web farm. The NASs 373 are notrequired if there is no critical data to be stored, e.g. if the web farmis operating solely to provide web caching services.

[0204] Management control of the web farm 360 can be provided through apair of System Management Servers (SMSs) 362. Each SMS 362 can beconnected to a management network via a link 366 and to a managementconsole 365. The SMSs 362 can communicate with the individual shelves 41via a pair of management switches 364. Each shelf 41 and NAS 373 can beconnected to each management switch 364 via a connection 367. Thus dualredundant management connections can be provided to each shelf 41 andNAS 373.

[0205] Flow of data to and from the web farm 360 can be provided througha pair of data switches 369. Each data switch 369 can be connected to aconsumer network via a link 370. It is to be understood that theconsumer network can be a larger data network to which the web farm 360is connected. This network can be an office or corporation intranet, alocal area network (LAN), a wide area network (WAN), the Internet or anyother network. Connections between the data switches and the shelves 41can be facilitated by connections 371. It is to be noted that as eachshelf has its own switching capability, there is no need for each shelf41 to be directly connected to the data switches 369. Connections canalso be provided to connect the WAS units 373 to the shelves 41. Thetopology used for interconnection of the data switches 369, shelves 41and NASs 373 can be any topology providing at least one connection ofany length between every possible pair of units. Complex topologiesarranged to minimise the maximum connection length between any two givenunits in the web farm can be used.

[0206] The web farm 360 comprising a plurality of shelves 41 with orwithout a plurality of NASs 373 can suitably be used as any or all ofthe entry edge server group 9, web edge server group 15 and applicationservers 19 described above with reference to FIG. 1.

[0207] As an alternative to providing critical data storage within a NAS373, such storage can be provided within one or more NAS cartridgesfitted into one or more of the shelves 41 in place of processingcartridges 43. Another alternative is to provide a server shelf withlocal storage such as a RAID array (Redundant Array of InexpensiveDisks) in place of the NAS 373.

[0208] Thus there has now been described an example of a fullyconfigurable computing system based on a plurality of self containedfield replaceable units (FRUs) and scalable from a single processingcartridge with power supply and switching capability to a multiplyredundant multiprocessor server system with full system managementcapability extending over a number of co-operably connected servershelves. It will of course be readily apparent to the skilled readerthat many of the specific features specified in the above descriptionare in no way limiting and a variety of alternatives may be producedusing only ordinary skill and common general knowledge. Non-limitingexamples of example modifications which may be made to the abovedescribed system are discussed hereafter.

[0209] There is no limit placed on the processing cartridges as to whatsoftware they should run. Each module within a shelf or farm may rununder the same operating system, or a plurality of different operatingsystems may be used. Examples of possible operating systems include SunMicrosystems' Solaris® OS or another UNIX™-Type OS such as Linux™,MINIX™, or Irix™, or UNIX™ or a Microsoft OS such as Windows NT™,Windows 2000™, Windows ME/98/95™, Windows XP™.

[0210] It is also not necessary that each processing cartridge within ashelf or farm be configured to run the same program software. Forexample, individual processing cartridges may be configured to execute,for example, fileserver software, mailserver software, webhostingsoftware, database software, firewall software, or verificationsoftware.

[0211] Although it has been described above with reference to FIGS. 4,8, 12, 13 and 14, that functionality of a switch and of a shelf serviceprocessor should be provided within a single combined switch and serviceprocessor unit, this is not essential and separate switch and shelfservice processor field replaceable units may be used.

[0212] Although it has been described above that a pair of PSUs and apair of CSSPs may be provided so as to enable dual-redundancy, furtherPSUs and CSSPs may be provided so as to increase FRU redundancy further,thus providing statistically higher reliability.

[0213] In the power supply circuitry in each of the blades and CSSPs,two voltage sense circuits may be provided after the fuses and beforethe diodes, to prevent a latent fault caused by a failed fuse goingundetected until one of the PSUs is removed or taken offline. Suchcircuits may configured to withstand an overvoltage at their inputswhilst the input they are feeding is not powered, without any leakage tothe unpowered circuit.

[0214] Although it has been described above with particular reference toFIG. 11 that the processing module may be based on an UltraSPARC™processor, this is not limiting and any other processor havingsufficient processing capacity to undertake the tasks required of aparticular processing cartridge may be used. Alternative processorsinclude, but are not limited to, Intel x86 series and compatibleprocessors, AMD x86 compatible processors, Alpha processors and PowerPCprocessors. The particular example of an x86 compatible processor isdescribed in more detail with reference to FIG. 18. In FIG. 18, theparts corresponding to those of the UltraSPARC™ based system of FIG. 11have the same reference numerals and will not be described again here.In a system based on an x86 compatible processor, the processor 378itself communicates with the other components, including the memory 196and PCI bus 198 via a Northbridge 379. The Northbridge 379 also includesan interrupt controller, so no separate interrupt concentrator isrequired. The other components of the processing cartridge could besubstantially the same as for the UltraSPARC™ based system describedabove.

[0215] Although it has been described above that each informationprocessing cartridge comprises a single microprocessor, this is not alimiting case as each or any of the information processing cartridgesmay have more than one microprocessor arranged to share common storageresources to operate synchronously (in lockstep) or asynchronously.Also, it is not necessary that all information processing cartridgesinserted into a shelf at a given time are identical, rather a variety ofdifferent blade architectures may be used simultaneously.

[0216] The provision of the functions of both Switch and Shelf ServiceProcessor within a single FRU in the present example provides a facilitywithin a single shelf 41 for dual redundancy in both functions in fewerdifferent FRUs. As will be appreciated, there is no restriction thatthese two functions must be provided within a single FRU and division ofthe two functions into separate FRUs would present no difficulty to theskilled addressee.

[0217] The backup power provision for the cooling fans of the PSUs isdescribed above with reference to FIG. 13. Although it is described thatthe backup power supply to each fan should be independent of the other,if the risk of common mode failure of backup power supply is judged tobe low, or is of low importance, then the backup supply to each fan maybe provided in common with the backup supply to all other fans.

[0218] Also, an information processing module forming a fieldreplaceable server blade can include a processor and memory can beconfigured by means of software, firmware or hardware to provide aspecial purpose function. By way of examples only, an informationprocessing module can be configured to perform the function of one ormore of a firewall, or a load balancer, encryption and/or decryptionprocessing, an interface to a secure network, e.g. a virtual privatenetwork (VPN), a specialized switch with wide area network (WAN)connectability.

[0219] Also, a storage blade may be provided. The storage blade can beconfigured to be mountable in a server blade receiving location in ablade server carrier. The storage blade can comprise storage bladeconnectors configured for interconnecting with carrier connectors on theserver blade carrier, whereby the storage blade is interchangeable witha server blade. A carrier, or shelf, for a server system can be arrangedwith a plurality of blade receiving locations for receiving blades,wherein the blades can be storage blades or information processingblades. The server system can be self configuring on receipt of theblades according to the type of blade received in each said location. Toachieve the blade service controller in each blade can be operable tocommunicate with a shelf service processor to perform said configuring.

[0220] In the above described systems, it is proposed to provide twoinformation connections from each information processing module, orserver blade, 43 over the midplane to the respective CSSP modules 71.The provision of these redundant information connections means that inthe event of the failure or absence of one of the CSSPs 71, theinformation processing module 43 can continue to function using theother of the information connections. It will be appreciated that morethat two information connections could be provided to yet furtherincrease levels of redundancy. However, although such additioninformation connections might be provided in exceptional applications,the cost of such additional information connections would not bejustified in most applications as the additional reliability gains wouldtypically be very small compared to the additional cost.

[0221] In the examples of an information processing module describedwith reference to FIG. 11 or FIG. 18, information signal interfaces thatinclude an Ethernet interface and a serializer/deserializer areillustrated. FIG. 19A reproduces part of the information processingmodule shown in FIG. 11. FIG. 19A shows an example where, for enablinginformation to be passed between the processor 192 to the midplane 171,two information protocol interfaces (IPIs) in the form of Ethernetprotocol interfaces (EI) 207 and 208 are provided. The Ethernet protocolinterfaces 207 and 208 are connected to the processor 192 via theprocessor bus 198 and respective bus connections 411 and 412. Each ofthe Ethernet protocol interfaces 207 and 208 is also connected to arespective physical layer interface (PLI) 209 and 210 in the form ofSERializer/DESerializer (SERDES) devices by respective informationsignal paths 413 and 414. The SERDES devices 209 and 210 are connectedin turn to respective information connections 224 and 225 on themidplane connector 120 via respective information connection paths 415and 416. The combination of the IPIs (Ethernet protocol interfaces 207,208) and the PLIs (SERDES devices 209, 210) forms an information signalinterface 401.

[0222] As has already been described above, the use of the SERDESdevices 209 and 210 means that the PLI is able to support not only anEthernet information protocol, but also an Infiniband informationprotocol. In this case, the information connection paths 415 and 416will each comprise differential PECL TX+/− and RX+/− (Positive EmitterCoupled Logic Transmit and Receive) pairs to communicate to the switchportions of the CSSPs 71 over the midplane 171. The RX+/− pairs can beAC coupled at the information processing module 43 and the TX+/− pairscan be AC coupled at each CSSP 71. The SERDES devices are able tosupport multiple information protocols, and in particular the higherbandwidth requirements of an Infiniband protocol compared to an Ethernetprotocol. Accordingly, in order to adapt the information processingmodule for operating under an Infiniband protocol it is merely necessaryto replace the Ethernet protocol interfaces 207 and 208 by Infinibandprotocol interfaces. This is illustrated in FIG. 1 9B.

[0223]FIG. 19B corresponds to FIG. 19A with the exception that theEthernet protocol interfaces 207 and 208 of FIG. 19A have been replacedby Infiniband protocol interfaces (II) 407 and 408. The Infinibandprotocol interfaces 407 and 408 are connected to the processor 192 viathe processor bus 198 and the respective bus connections 411 and 412.Each of the Infiniband protocol interfaces 407 and 408 is also connectedto a respective one of the physical layer interfaces (PLI) 209 and 210in the form of SERializer/DESerializer (SERDES) devices by therespective information signal paths 413 and 414. The SERDES devices 209and 210 are connected in turn to respective information connections 224and 225 on the midplane connector 120 via respective informationconnection paths 415 and 416.

[0224] Accordingly, the use of SERDES devices as physical layerinterfaces enables the information processing modules to be suppliedwith a minimum of modification to support an Ethernet protocol,Infiniband protocol, or indeed any other appropriate informationprotocol supportable by the SERDES devices.

[0225] An information protocol compatibility check can be provided atinitialization. For example, initialization software or firmware in theinformation processing module, for example in the PROM 201 shown in FIG.11, can be operable on initialization to cause the service controller203 to send management information to the shelf service processor 47 toinform the shelf service processor 74 of the information transmissionprotocol (e.g., Ethernet or Infiniband) it can support and/or to solicitinformation as to the information transmission protocol employed by theCSSP 71 to communicate with the information processing modules 43. Theshelf service processor 74 can then be operable to indicate whether theinformation protocol that the information processing module 43 cansupport is compatible with the information transmission protocolemployed the CSSP 71 to communicate with the information processingmodules 43. If the service controller 203 receives a reply indicatingthat the information transmission protocol supported by the informationprocessing module 43 is not compatible with the information transmissionprotocol employed by the CSSP 71, the service controller 203 can beoperable in response thereto to prevent initialization of theinformation processing module from completing, possibly after reportinga fault via the management signal connection(s). Otherwise the servicecontroller 203 can be operable to complete initialization of theinformation processing module.

[0226] Alternatively, or in addition, on initialization, or in use, theshelf service processor 74 can provide information to the servicecontroller 203 in the information processing module identifying theinformation transmission protocol employed by the CSSP 71 to communicatewith the information processing modules 43. The service controller 203can then be operable to determine whether the information transmissionprotocol identified by the shelf service controller 74 is supported bythe information processing module. If the identified informationtransmission protocol is not supported by the information processingmodule, then the service controller 203 can be operable to preventinitialization of the information processing module from completing,possibly after reporting a fault via the management signalconnection(s). Otherwise the service controller 203 can be operable tocomplete initialization of the information processing module.

[0227] There has been described an information processing module for amodular computer system, the information processing module includingprocessor means for performing information processing, moduleinformation connection means for communicating information signals,module information signal interface means connected between theprocessor means and the module information connection means, modulemanagement connection means for communicating management signals, andservice controller means operable to perform system managementfunctions, the service controller means being connected to the modulemanagement connection means. This configuration enables the provision ofa processor technology independent information server blade for amodular server system. Thus, as described above, a server blade can beimplemented using one or more processors selected, merely by way ofexample, from an UltraSPARC processor, an Intel x86 series andcompatible processors, AMD x86 compatible processors, Alpha processorsand PowerPC processors.

[0228] Although the embodiments above have been described inconsiderable detail, numerous variations and modifications will becomeapparent to those skilled in the art once the above disclosure is fullyappreciated. It is intended that the following claims be interpreted toembrace all such variations and modifications.

What is claimed is:
 1. An information processing module for a modularcomputer system, the information processing module comprising at leastone processor operable to perform information processing, at least onemodule information connection for communicating information signals, atleast one module information signal interface connected between said atleast one processor and said at least one module information connection,at least one module management connection for communicating managementsignals, and at least one service controller operable to perform systemmanagement functions, said at least one service controller beingconnected to said at least one module management connection.
 2. Theinformation processing module of claim 1, wherein said at least onemodule information signal interface comprises at least one moduleinformation protocol interface.
 3. The information processing module ofclaim 2, wherein said at least one module information protocol interfacecomprises an Ethernet interface.
 4. The information processing module ofclaim 2, wherein said at least one module information protocol interfacecomprises an Infiniband interface.
 5. The information processing moduleof claim 1, wherein said at least one module information signalinterface comprises at least one module information physical layerinterface.
 6. The information processing module of claim 5, wherein saidat least one module information physical layer interface comprises atleast one serializer/deserializer.
 7. The information processing moduleof claim 1, comprising a plurality of module information connections. 8.The information processing module of claim 7, comprising two moduleinformation connections.
 9. The information processing module of claim1, wherein the module management connection comprises a serialconnection.
 10. The information processing module of 1, comprising aplurality of module management connections, the module servicecontroller being connected to each module management connection.
 11. Theinformation processing module of claim 10, comprising two modulemanagement connections.
 12. The information processing module of claim1, further comprising an internal storage device.
 13. The informationprocessing module of claim 1, comprising an enclosure, said at least onemodule information connection and said at least one module managementconnection being accessible externally to the enclosure.
 14. Theinformation processing module of claim 1, configured as a fieldreplaceable server blade.
 15. A modular computer system configured toreceive at least one information processing module that includes atleast one module information connection for communicating informationsignals and at least one module management connection for communicatingmanagement signals, the modular computer system comprising a carrierincluding: at least one module receiving location configured to receivean information processing module, the module receiving locationcomprising at least one carrier information connection operable tointerconnect with a corresponding module information connection of areceived information processing module and at least one carriermanagement connection operable to interconnect with a correspondingmodule management connection of a received information processingmodule; at least one switch connectable to at least one carrierinformation connection of at least one module receiving location andoperable to connect the information processing module to an externalinformation network; and at least one carrier service processorconnectable to at least one carrier management connection of at leastone module receiving location and operable to exchange system managementsignals with the information processing module service controller. 16.The computer system of claim 15, wherein said at least one modulereceiving location is configured removably to receive the informationprocessing module.
 17. The computer system of claim 15, wherein thecarrier is configured to receive a plurality of information processingmodules in respective module receiving locations.
 18. The computersystem of claim 17, wherein each switch is connectable to a carrierinformation connection at each module receiving location and is operableselectively to connect each received information processing module to anexternal information network.
 19. The computer system of claim 18,wherein each module receiving location comprises two carrier informationconnections operable to interconnect with a respective moduleinformation connection of a received information processing modulehaving two module information connections, and the carrier includes twoswitches, each connectable to a respective carrier informationconnection of at least one module receiving location.
 20. The computersystem of claim 19, wherein each switch is connectable to a respectivecarrier information connection at each module receiving location. 21.The computer system of claim 19, comprising first and second switchmodules removably mountable in the carrier, each switch modulecomprising a respective switch.
 22. The computer system of claim 21,comprising two service processors, a first service processor beingoperable as a master service processor and a second service processorbeing operable as a backup service processor.
 23. The computer system ofclaim 22, wherein each switch module further comprises a respectiveservice processor to form a combined switch and service processormodule.
 24. The computer system of claim 15, wherein the carriercomprises at least one power supply connectable to each informationprocessing module received in a carrier receiving location viarespective power connections.
 25. The computer system of claim 15,wherein the carrier is a rack mountable shelf.
 26. The computer systemof claim 15, including at least one information processing module, theinformation processing module comprising at least one processor operableto perform information processing, at least one module informationconnection for communicating information signals, at least one moduleinformation signal interface connected between said at least oneprocessor and said at least one module information connection, at leastone module management connection for communicating management signals,and at least one service controller operable to perform systemmanagement functions, said at least one service controller beingconnected to said at least one module management connection.
 27. Aserver blade for a modular computer system, the server blade comprisinga processor operable to perform information processing, a bladeinformation connection for communicating information signals, a bladeinformation signal interface connected between the processor and theblade information connection, a blade management connection forcommunicating information signals, and a service controller operable toperform system management functions, the service controller beingconnected to the blade management connection.
 28. The server blade ofclaim 27, wherein the blade information signal interface comprises aninformation protocol interface.
 29. The server blade of claim 28,wherein the blade information protocol interface comprises an Ethernetinterface.
 30. The server blade of claim 28, wherein the bladeinformation protocol interface comprises an Infiniband interface. 31.The server blade of claim 27, wherein the blade information signalinterface comprises a blade information physical layer interface. 32.The server blade of claim 31, wherein the blade information physicallayer interface comprises a serializer/deserializer.
 33. The serverblade of claim 27, comprising a plurality of blade informationconnections.
 34. The server blade of claim 33, comprising two bladeinformation connections.
 35. The server blade of claim 27, wherein theblade management connection comprises a serial connection.
 36. Theserver blade of claim 27, comprising a plurality of blade managementconnections, the blade service controller being connected to each blademanagement connection.
 37. The server blade of claim 36, comprising twoblade management connections.
 38. The server blade of claim 27,comprising an internal storage device.
 39. The server blade of claim 27,comprising an enclosure, said blade information and managementconnections being accessible externally to the enclosure.
 40. The serverblade of claim 27 configured as a field replaceable unit.
 41. A methodof providing a processor technology independent information server bladefor a modular server system, the server blade comprising at least oneprocessor operable to perform information processing, the methodcomprising: the processor communicating information signals with othermodules of the server system via at least one blade information signalinterface between said at least one processor and at least one bladeinformation connection for communicating information signals; and atleast one service controller in the blade performing system managementfunctions within the blade and communicating management signals to othermodules of the server system via at least one module managementconnection.
 42. An information processing module for a modular computersystem, the information processing module comprising processor means forperforming information processing, module information connection meansfor communicating information signals, module information signalinterface means connected between the processor means and the moduleinformation connection means, module management connection means forcommunicating management signals, and service controller means operableto perform system management functions, the service controller meansbeing connected to the module management connection means.